2008 58th Electronic Components and Technology Conference 2008
DOI: 10.1109/ectc.2008.4549977
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Bi-directional optical communication at 10 Gb/s on FR4 PCB using reflow solderable SMT transceiver

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Cited by 6 publications
(5 citation statements)
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“…This embedded optical transmitter/receiver (Tx/Rx) modules provide smaller packaging, high system bandwidth, and design flexibility for the board and system level interconnect. Some institutes or companies have carried out research related to this area or even made products [9,10]. It can be used for close on-board inter-chip interconnections, as shown in Figure 1, as well as for the board edge applications.…”
Section: Introductionmentioning
confidence: 99%
“…This embedded optical transmitter/receiver (Tx/Rx) modules provide smaller packaging, high system bandwidth, and design flexibility for the board and system level interconnect. Some institutes or companies have carried out research related to this area or even made products [9,10]. It can be used for close on-board inter-chip interconnections, as shown in Figure 1, as well as for the board edge applications.…”
Section: Introductionmentioning
confidence: 99%
“…Transmitting the data by the use of the beam propagates along the optical waveguide, and this technology can provide high-density interconnect channels for this level of optical interconnection between two chips or only in one chip. Using the integrated optical path which constituted by the integrated light source and detector to complete the connection [ 1,2] . This technology is not yet mature, to decreasing the turning loss of the optically coupled modules and controlling the coupled tolerance are still need to be overcome.…”
Section: Introductionmentioning
confidence: 99%
“…In general, silicon or ceramic materials are used as substrates which contain densely spaced micro strip lines for high speed electrical signal transmission [5][6][7].…”
Section: Introductionmentioning
confidence: 99%