A series of aluminum hypophosphite (AHPi)/graphite-like carbon nitride (g-C3N4) (designated as CAHPi) hybrids were prepared, followed by incorporation into thermoplastic polyurethane (TPU). The introduction of CAHPi hybrids into TPU led to a marked reduction in the peak of the heat release rate (pHRR), total heat release, weight loss rate, smoke production rate and total smoke production (TSP). For instance, pHRR and TSP decreased by 40% and 50% for TPU/CAHPi20. Furthermore, the increasing fire growth index and decreasing fire performance index were obtained for TPU/CAHPi systems, suggesting reduced fire hazards. It was found that improved fire safety of TPU nanocomposites was contributed by condensed phase and gas phase mechanisms. On one hand, g-C3N4 accelerated the thermal decomposition of AHPi for the formation of more char layers. On the other hand, g-C3N4 induced AHPi to generate more free radical capture agents when exposed to flame, besides protecting AHPi against thermal oxidation.

Extensive application of epoxy resins (EPs) is highly limited by their intrinsic flammability. Combining EPs with nanoparticles and phosphorus‐nitrogen flame retardants is an effective approach to overcome the drawback. In this work, simultaneous incorporation of octa‐aminophenyl polyhedral oligomeric silsesquioxanes (OapPOSS) and polyphosphazene into EP was reported for the first time. Significantly, reduced peak of heat release rate and UL‐94 V‐0 rating were achieved by tuning suitable ratios of polyphosphazene and OapPOSS for EP composites. During combustion, polyphosphazene promoted char formation and released nonflammable gases such as CO2, NH3, and N2 to dilute oxygen concentration and cool pyrolysis zone. Moreover, numerous phosphorus‐containing species acting as free radical scavengers were generated during degradation. Silicon dioxide evolving from OapPOSS protected char residues from thermal degradation. This study provides a novel method to fabricate high‐performance flame‐retardant EP composites, which have potential applications in the field of electrics and electronics.

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