The critical size limit of electric polarization remains a fundamental question in nanoscale ferroelectric research 1 . As such, the viability of ultrathin ferroelectricity greatly impacts emerging low-power logic and nonvolatile memories 2 . Size effects in ferroelectrics have been thoroughly investigated for perovskite oxides -the archetypal ferroelectric system 3 . Perovskites, however, have so far proved unsuitable for thickness-scaling and integration with modern semiconductor processes 4 . Here, we report ultrathin ferroelectricity in doped-HfO2, a fluorite-structure oxide grown by atomic layer deposition on silicon. We demonstrate the persistence of inversion symmetry breaking and spontaneous, switchable polarization down to 1 nm. Our results indicate not only the absence of a ferroelectric critical thickness, but also enhanced polar distortions as film thickness is reduced, contradictory to perovskite ferroelectrics. This work shifts the focus on the fundamental limits of ferroelectricity to simpler transition metal oxide systems -from perovskite-derived complex oxides to fluoritestructure binary oxides -in which 'reverse' size effects counter-intuitively stabilize polar symmetry in the ultrathin regime.Ferroelectric materials exhibit stable states of collectively ordered electrical dipoles whose polarization can be reversed under an applied electric field 5 . Consequently, ultrathin ferroelectrics are of great technological interest for high-density electronics, particularly field-effect transistors and nonvolatile memories 2 . However, ferroelectricity is typically suppressed at the few nanometer scale in the ubiquitous perovskite oxides 6 . First-principles calculations predict six unit cells as the critical thickness in perovskite ferroelectrics 1 due to incomplete screening of depolarization fields 3 . Atomic-scale ferroelectricity in perovskites often fail to demonstrate polarization switching 7,8 , a crucial ingredient for application. Furthermore, attempts to synthesize ferroelectric perovskite films on silicon 9,10 are plagued by chemical incompatibility 4,11 and high temperatures required for epitaxial growth. Since the discovery of ferroelectricity in HfO2-based thin films in 2011 12 , fluorite-structure binary oxides (fluorites) have attracted considerable interest 13 as they enable lowtemperature synthesis and conformal growth in three-dimensional (3D) structures on silicon 14,15 , thereby overcoming many of the issues that restrict its perovskite counterparts in terms of complementary metal-oxide-semiconductor (CMOS) compatibility and thickness scaling 16 .
We report on the stabilization of the ferroelectric phase in Hf0.8Zr0.2O2 with a tungsten capping layer. Ferroelectricity is obtained in both metal-insulator-metal (MIM) and metal-insulator-semiconductor (MIS) capacitors with highly-doped Si serving as the bottom electrode in the MIS structure. Ferroelectricity is confirmed from both the electrical polarization-voltage (P-V) measurement and X-Ray Diffraction analysis that shows the presence of an orthorhombic phase. High-resolution Transmission Electron Microscopy and Energy Dispersive X-ray spectroscopy show minimal diffusion of W into the underlying Hf0.8Zr0.2O2 after the crystallization anneal. This is in contrast to significant Ti and N diffusion observed in ferroelectric HfxZr1-xO2 commonly capped with TiN.
Depletion-mode quaternary barrier In 0.13 Al 0.83 Ga 0.04 N high-electron-mobility transistors (HEMTs) with regrown ohmic contacts and T-gates on a SiC substrate have been fabricated. Devices with 40-nm-long footprints show a maximum output current density of 1.8 A/mm, an extrinsic dc transconductance of 770 mS/mm, and cutoff frequencies f T /f max of 230/300 GHz at the same bias, which give a record-high value of √ f T • f max = 263 GHz among all reported InAl(Ga)N barrier HEMTs. The device speed shows good scalability with gate length despite the onset of short-channel effects due to the lack of a back barrier. An effective electron velocity of 1.36 × 10 7 cm/s, which is comparable with that in the state-of-the-art deeply scaled AlN/GaN HEMTs, has been extracted from the gate-length dependence of f T for gate lengths from 100 to 40 nm.
Depletion-mode high-electron-mobility transistors (HEMTs) with an 11 nm quaternary In0.13Al0.83Ga0.04N barrier and a 5 nm In0.05Ga0.95N channel on SiC substrates have been fabricated. The as-processed HEMT structure features a channel electron density of 2.08×1013 cm-2 and a mobility of 1140 cm2 V-1 s-1. A device with a 50-nm-long T-shaped gate shows a maximum output current density of 2.0 A/mm, a peak extrinsic DC transconductance of 690 mS/mm, and cut-off frequencies fT/fmax of 260/220 GHz at the same bias, representing a record high √fT·fmax of 239 GHz for InGaN channel HEMTs.
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