In this paper, we present a comprehensive uncertainty budget for on-wafer S-parameter measurements of devices on a custom-built fused silica wafer, including instrumentation errors, connector repeatability, and calibration standard uncertainties. All major steps toward achieving traceability with the aid of a multiline thru-reflect-line calibration for the given measurement scenario are explained. For the first time, it is now possible to compare against each other the relative importance of different sources of uncertainty in on-wafer measurements. Results are shown for three typical devices with varying reflection and transmission characteristics.
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