Morphologically driven dynamic wickability is essential for determining the hydrodynamic status of solid-liquid interface. We demonstrate that the dynamic wicking can play an integral role in supplying and propagating liquid through the interface, and govern the critical heat flux (CHF) against surface dry-out during boiling heat transfer. For the quantitative control of wicking, we manipulate the characteristic lengths of hexagonally arranged nanopillars within sub-micron range through nanosphere lithography combined with top-down metal-assisted chemical etching. Strong hemi-wicking over the manipulated interface (i.e., wicking coefficients) of 1.28 mm/s0.5 leads to 164% improvement of CHF compared to no wicking. As a theoretical guideline, our wickability-CHF model can make a perfect agreement with improved CHF, which cannot be predicted by the classic models pertaining to just wettability and roughness effects, independently.
Enhancing the critical heat flux (CHF), which is the capacity of heat dissipation, is important to secure high stability in two-phase cooling systems. Coolant supply to a dry hot spot is a major mechanism to prevent surface burn-out for enhancing the CHF. Here, we demonstrate a more ready supply of coolant using aligned silicon nanowires (A-SiNWs), with a high aspect ratio (>10) compared to that of conventional random silicon nanowires (R-SiNWs), which have a disordered arrangement, for additional CHF improvement. We propose the volumetric wicking rate, which represents the coolant supply properties by considering both the liquid supply velocity and the amount of coolant (i.e., wicking coefficient and wetted volume, respectively). Through experimental approaches, we confirm that the CHF is enhanced as the volumetric wicking rate is increased. In good agreement with the fabrication hypothesis, A-SiNWs demonstrate higher coolant supply abilities than those of R-SiNWs. The longest (7 μm) A-SiNWs have the highest volumetric wicking rate (25.11 × 10 mm/s) and increase the CHF to 245.6 W/cm, which is the highest value obtained using nanowires among reported data (178 and 26% enhanced vs unmodulated plain surface and R-SiNWs, respectively). These well-aligned SiNWs can increase the CHF significantly with efficient coolant supply, and it can ensure high stability in extremely high thermal load systems. Moreover, our study provides nanoscale interfacial design strategies for further improvement of heat dissipation.
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