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The microstructure and phase composition of Al/Ti/Al interfaces with respect to their localization were investigated. An aluminum-flyer plate exhibited finer grains located close to the upper interface than those present within the aluminum-base plate. The same tendency, but with a higher number of twins, was observed for titanium. Good quality bonding with a wavy shape and four intermetallic phases, namely, TiAl 3 , TiAl, TiAl 2 , and Ti 3 Al, was only obtained at the interface closer to the explosive material. The other interface was planar with three intermetallic compounds, excluding the metastable TiAl 2 phase. As a result of a 100-hour annealing at 903 K (630°C), an Al/TiAl 3 /Ti/TiAl 3 /Al sandwich was manufactured, formed with single crystalline Al layers. A substantial difference between the intermetallic layer thicknesses was measured, with 235.3 and 167.4 lm obtained for the layers corresponding to the upper and lower interfaces, respectively. An examination by transmission electron microscopy of a thin foil taken from the interface area after a 1-hour annealing at 825 K (552°C) showed a mixture of randomly located TiAl 3 grains within the aluminum. Finally, the hardness results were correlated with the microstructural changes across the samples.

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