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López, Gabriel A.; Sommadossi, S.; Gust, W.; Mittemeijer, E. J.; Zięba, P.

doi:10.1023/a:1015172710411

Cited by 67 publications

(17 citation statements)

References 4 publications

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“…The error bars shown correspond to the respective standard deviations. Growth of an interfacial layer can be described, using a simple growth model, 18,19 according to…”

Section: Microstructure After and Kinetics Of Solidstate Agingmentioning

confidence: 99%

Microstructural development of Sn-Ag-Cu solder joints

Fix

López²,

Brauer

et al. 2005

Journal of Elec Materi

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The effects of Cu as pad material and of the metallization of pad (with Sn) and component (with Ni) on the evolving microstructure of lead-free solder joints were studied. A solder paste with composition 95.5wt.%Sn-4.0wt.%Ag-0.5wt.%Cu was used. Partial dissolution of the Cu substrate led to a change in the overall composition of the solder, which caused a precipitation morphology different from the one expected regarding the initial composition. Kinetics of growth of the Cu 6 Sn 5 phase, as particles in the bulk of the solder and as a reaction layer adjacent to the Cu pad, was studied in the temperature range 125-175°C.

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“…The error bars shown correspond to the respective standard deviations. Growth of an interfacial layer can be described, using a simple growth model, 18,19 according to…”

Section: Microstructure After and Kinetics Of Solidstate Agingmentioning

confidence: 99%

Microstructural development of Sn-Ag-Cu solder joints

Fix

López²,

Brauer

et al. 2005

Journal of Elec Materi

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“…There are many special requirements such as high specific strength, stiffness and low density that are imposed on the materials used in aircraft, rocket building and power engineering [1][2]. Some types of intermetallic compounds meet these requirements and may become a promising basis for manufacturing of the details applied in critical conditions at high load and temperature.…”

Section: Introductionmentioning

confidence: 99%

“…These materials have unique properties that allow their use in the advanced aerospace industry. At the same time, their extensive use is limited by increased brittleness, especially at low temperatures [2]. Reliable utilization of the products manufactured of these materials is only possible under such conditions that enhance ductility, for example, heating [3].…”

Section: Introductionmentioning

confidence: 99%

Formation of intermetallics at the interface of explosively welded Ni-Al multilayered composites during annealing

Ogneva

Lazurenko

Батаев

et al. 2016

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. The Ni-Al multilayer composite was fabricated using explosive welding. The zones of mixing of Ni and Al are observed at the composite interfaces after the welding. The composition of these zones is inhomogeneous. Continuous homogeneous intermetallic layers are formed at the interface after heat treatment at 620 °C during 5 h. These intermetallic layers consist of NiAl 3 and Ni 2 Al 3 phases. The presence of mixed zones significantly accelerates the growth rate of intermetallic phases at the initial stages of heating.

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“…[7,8] Usually the whole liquid is consumed to create the first intermetallic phase but there are exceptions (Ni/Al/Ni system) where two intermetallics can coexist with unconsumed liquid phase. [9,10] The interconnection obtained after diffusion soldering possesses thermal and mechanical properties of the intermetallic phases present in the joint. After the termination of the process the joint consists exclusively of intermetallic phases.…”

mentioning

confidence: 99%

The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection

2006

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Since lead-tin solders have been acknowledged as the strongly harmful to men's life and environment, both new solders and attractive joining technologies are searched. [1][2][3][4] There are several important bonding method issues that have to be considered when talking about Pb-free solders, among them their thermal and mechanical stability, wetting characteristics, availability, non-toxicity and cost.Recently, diffusion soldering has been shown as a good candidate to fulfill these demands and homogeneous joints maybe produced. [5,6] This straightforward method bases on four stages: heating, dissolution, isothermal solidification and growth of intermetallic phases. Solder is usually introduced as a thin foil clamped between two high melting metal bars under a low pressure and heated up to the joining temperature, which is slightly above the foil melting point. During first stage -heating, diffusion between substrates and the foil takes place. At the second stage -dissolution occurs along with the temperature increase up to the joining temperature. High melting (HM) element is dissolved in the liquid low melting (LM) component. Further annealing leads to the third stage called isothermal solidification controlled by the diffusion of liquid element to solid substrate. At the liquid/solid interface the concentration of solder become fixed as the local equilibrium is assumed. In this way, the thickness of the liquid area shrinks gradually until the whole LM is consumed and the first intermetallic phase (IP) appears in the interconnection zone. It grows during the last period called growth of the intermetallic phases. Sequence of IPs appearance can be predicted looking at the appropriate equilibrium phase diagram of the LM and HM components. [7,8] Usually the whole liquid is consumed to create the first intermetallic phase but there are exceptions (Ni/Al/Ni system) where two intermetallics can coexist with unconsumed liquid phase. [9,10] The interconnection obtained after diffusion soldering possesses thermal and mechanical properties of the intermetallic phases present in the joint. After the termination of the process the joint consists exclusively of intermetallic phases. On the contrary, the conventional soldering results only in the thin layer of intermetallics adjacent to the base material. The rest of the joint area is occupied by the solder.Under normal service conditions the elements are endanger on high temperature. The differences in thermal expansion between the components are the source of shear loading. Therefore, the testing of mechanical properties should be one of major type of joint investigation. This work is focused on In-48 at%. Sn interconnection produced by diffusion soldering in temperature range of 200-300°C. The choice of the applied solder was dictated by low melting temperature of the eutectic alloy (118°C). In order to form intermetallic phases and investigate their influence on mechanical properties of the joint various temperatures and different times of annealing were selected.Results ...

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Cited by 67 publications

References 4 publications

Microstructural development of Sn-Ag-Cu solder joints

Microstructural development of Sn-Ag-Cu solder joints

Formation of intermetallics at the interface of explosively welded Ni-Al multilayered composites during annealing

The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection

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