Patterned etching of GaN films was achieved with laser-induced thermal decomposition. High-energy laser pulses are used to locally heat the film above 900 °C, causing rapid nitrogen effusion. Excess gallium is then removed by conventional etching. At exposures of 0.4 J/cm2 with 355 nm light, etch rates of 50–70 nm per pulse were obtained. Illumination with an interference grating was used to produce trenches as narrow as 100 nm.
A method for the extraction of power dissipation sources inside semiconductor devices on a nanosecond-time scale is proposed using a backside transient interferometric mapping technique. The two-dimensional power dissipation density is extracted from the time and space derivative of the measured optical phase shift. The method is applied to the analysis of moving current filaments in an electrostatic discharge protection device operating in the avalanche regime. It is found that the filament dynamics is governed by the negative temperature dependence of the impact ionization coefficient. The total power calculated from the optical measurements is in excellent agreement with the electrical input power.
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