Graphene nanowalls (GNWs) are wall-like graphene nanosheets that are oriented vertically on a substrate. GNWs have a unique structure and special optoelectronic properties, which enables their use in photodetectors. In this paper, we use plasma-enhanced chemical vapor deposition to directly grow GNWs onto the surface of an n-type lightly doped Si substrate and to optimize the quality of the GNWs by adjusting the growth time and temperature. Furthermore, after the GNWs are lithographically patterned, we use a GNW-Si Schottky structure to develop photodetector arrays which are capable of detecting light from the visible to infrared light spectral range. Throughout the process, GNWs are directly synthesized on a Si substrate without using a catalyst or a transfer step. The process is simple and efficient. Under laser illumination at a wavelength of 792 nm, the highest on/off ratio at zero bias is approximately 105, and the specific detectivity is 7.85 × 106 cm Hz1/2/W. Under a reverse bias of 4 V, the measured responsivity of the detector reaches 1 A/W at room temperature. The device can also produce a light response in the near-infrared band. Upon laser illumination at a wavelength of 1550 nm, the detector shows a responsivity of 12 mA/W at room temperature.
Chemical vapor deposited graphene suffers from two problems: transfer from metal catalysts to insulators, and photoresist induced degradation during patterning. Both result in macroscopic and microscopic damages such as holes, tears, doping, and contamination, translated into property and yield dropping. We attempt to solve the problems simultaneously. A nickel thin film is evaporated on SiO as a sacrificial catalyst, on which surface graphene is grown. A polymer (PMMA) support is spin-coated on the graphene. During the Ni wet etching process, the etchant can permeate the polymer, making the etching efficient. The PMMA/graphene layer is fixed on the substrate by controlling the surface morphology of Ni film during the graphene growth. After etching, the graphene naturally adheres to the insulating substrate. By using this method, transfer-free, lithography-free and fast growth of graphene realized. The whole experiment has good repeatability and controllability. Compared with graphene transfer between substrates, here, no mechanical manipulation is required, leading to minimal damage. Due to the presence of Ni, the graphene quality is intrinsically better than catalyst-free growth. The Ni thickness and growth temperature are controlled to limit the number of layers of graphene. The technology can be extended to grow other two-dimensional materials with other catalysts.
The rapid development of neuromorphic computing has stimulated extensive research interest in artificial synapses. Optoelectronic artificial synapses using laser beams as stimulus signals have the advantages of broadband, fast response, and low crosstalk. However, the optoelectronic synapses usually exhibit short memory duration due to the low lifetime of the photo-generated carriers. It greatly limits the mimicking of human perceptual learning, which is a common phenomenon in sensory interactions with the environment and practices of specific sensory tasks. Herein, a heterostructure optoelectronic synapse based on graphene nanowalls and CsPbBr3 quantum dots was fabricated. The graphene/CsPbBr3 heterojunction and the natural middle energy band in graphene nanowalls extend the carrier lifetime. Therefore, a long half-life period of photocurrent decay - 35.59 s has been achieved. Moreover, the long-term optoelectronic response can be controlled by the adjustment of numbers, powers, wavelengths, and frequencies of the laser pulses. Next, an artificial neural network consisting of a 28 × 28 synaptic array was established. It can be used to mimic a typical characteristic of human perceptual learning that the ability of sensory systems is enhanced through a learning experience. The learning behavior of image recognition can be tuned based on the photocurrent response control. The accuracy of image recognition keeps above 80% even under a low-frequency learning process. We also verify that less time is required to regain the lost sensory ability that has been previously learned. This approach paves the way toward high-performance intelligent devices with controllable learning of visual perception.
A method for direct growth of graphene nanowalls (GNWs) on an insulating substrate by plasma enhanced chemical vapor deposition (PECVD) is reported. The effects of growth temperature, plasma power, carbon source concentration, gas ratio and growth time on the quality of GNWs are systematically studied. The Raman spectrum shows that the obtained GNWs have a relatively high quality with a D to G peak ratio (ID/IG) of 0.42. Based on the optimization of the quality of GNWs, a field-effect transistor (FET) photodetector is prepared for the first time, and its photo-response mechanism is analyzed. The responsivity of the photodetector is 160 mA/W at 792 nm and 55 mA/W at 1550 nm. The results reveal that the GNWs are promising for high performance photodetectors.
Graphene is an ideal material for wide spectrum detector owing to its special band structure, but its low light absorption and fast composite of photogenerated carriers lead to a weak response performance. In this paper, we designed a unique photoconductive graphene-InGaAs photodetector. The built-in electric field was formed between graphene and InGaAs, which can prolong the lifetime of photogenerated carriers and improve the response of devices by confining the holes. Compared with graphene-Si structure, a higher built-in electric field and reach to 0.54 eV is formed. It enables the device to achieve a responsivity of 60 AW−1 and a photoconductive gain of 79.4 at 792 nm. In the 1550 nm communication band, the responsivity of the device is also greater than 10 AW−1 and response speed is less than 2 ms. Meanwhile, the saturation phenomenon of light response was also found in this photoconductive graphene heterojunction detector during the experiment, we have explained the phenomenon by the capacitance theory of the built-in electric field, and the maximum optical responsivity of the detector is calculated theoretically, which is in good agreement with the measurement result.
Direct chemical vapor deposition of graphene on semiconductors and insulators provides high feasibility for integration of graphene devices and semiconductor electronics. However, the current methods typically rely on high temperatures (>1000 °C), which can damage the substrates. Here, a growth method for high-quality large-area graphene at 300 °C is introduced. A multizone furnace with gradient temperature control was designed according to a computational fluid dynamics model. The crucial roles of the chamber pressure in the film continuity and hydrogen composition in the graphene defect density at low temperature were revealed. As a result, a uniform graphene film with the Raman ratio I D/I G = 0.08 was obtained. Furthermore, a technique of laminating single-crystal Cu foil as a sacrificial layer on the substrate was proposed to realize transfer-free growth, and a wafer-scale graphene transistor array was demonstrated with good performance consistency, which paves the way for mass fabrication of graphene devices.
The use of metal foil catalysts in chemical vapor deposition of graphene films makes graphene transfer an ineluctable part in graphene device fabrication, which greatly limits the industrialization. Here, an oxide phase-change material (V2O5) was found to have the same catalytic effect on graphene growth as conventional metals. A uniform large-area graphene film can be obtained on a 10 nm V2O5 film. Density functional theory was used to quantitatively analyze the catalytic effect of V2O5. Due to the high resistance property of V2O5 at room temperature, the obtained graphene can be directly used in devices with the V2O5 as an intercalation layer. A wafer-scale graphene-V2O5-Si Schottky photodetector array was successfully fabricated. Illuminated by a 792 nm laser, the responsivity of the photodetector can reach 266 mA/W at 0 V bias and 420 mA/W at 2 V. The transfer-free device fabrication process enables high feasibility in industrialization.
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