Abstract. We present two transfer bonding schemes for incorporating fragile nanoporous inorganic membranes into microdevices. Such membranes are finding increasing use in microfluidics, due to their precisely controllable nanostructure. Both schemes rely on a novel dual-cure dry adhesive bonding method, enabled by a new polymer formulation: OSTE(+), which can form bonds at room temperature. OSTE(+) is a novel dual-cure ternary monomer system containing epoxy. After the first cure, the OSTE(+) is soft and suitable for bonding, while during the second cure it stiffens and obtains a Young's modulus of 1.2 GPa. The ability of the epoxy to react with almost any dry surface provides a very versatile fabrication method. We demonstrate the transfer bonding of porous silicon and porous alumina membranes to polymeric microfluidic chips molded into OSTE(+), and of porous alumina membranes to microstructured silicon wafers, by using the OSTE(+) as a thin bonding layer. We discuss the OSTE(+) dual-cure mechanism, describe the device fabrication, and evaluate the bond strength and membrane flow properties after bonding. The membranes bonded to OSTE(+) chips delaminate at 520 kPa, and the membranes bonded to silicon delaminate at 750 kPa, well above typical maximum pressures applied to microfluidic circuits. Furthermore, no change in membrane flow resistance was observed after bonding. Dry adhesive bonding of nanoporous inorganic membranes2
We introduce a novel dry wafer bonding concept designed for permanent attachment of micromolded polymer structures to surface functionalized silicon substrates. The method, designed for simultaneous fabrication of many lab-on-chip devices, utilizes a chemically reactive polymer microfluidic structure, which rapidly bonds to a functionalized substrate via ''click'' chemistry reactions. The microfluidic structure consists of an off-stoichiometry thiol-ene (OSTE) polymer with a very high density of surface bound thiol groups and the substrate is a silicon wafer that has been functionalized with common bio-linker molecules. We demonstrate here void free, and low temperature (, 37 uC) bonding of a batch of OSTE microfluidic layers to a silane functionalized silicon wafer.
A new method that allows for mold-free, rapid and easy-to-use prototyping of microfluidic devices comprising channels, access holes and surface modified patterns, is presented. The innovative method is based on direct photolithographic patterning of an off-stoichiometry thiol-ene (OSTE) polymer formulation, tailor-made for photolithography, which offers unprecedented spatial resolution and allows for efficient, robust and reliable, room temperature surface modification and glue-free, covalent room temperature bonding. This mold-free process does not require cleanroom equipment and therefore allows for rapid, i.e. less than one hour, design-fabricate-test cycles, using a material suited for larger scale production. The excellent photolithographic properties of this new OSTE formulation allow for unprecedented, for thiol-ene polymer systems, resolution patterning in hundreds of micrometers thick layers, 200 µm thick in this work. Moreover, we demonstrated robust (covalent) and spatially-controlled modification of the microchannel surfaces with a contact angle of 76 degrees to hydrophobic/hydrophilic areas with contact angles of 102 and 43 degrees, respectively.
We present a novel integration method for packaging silicon photonic sensors with polymer microfluidics, designed to be suitable for wafer-level production methods. The method addresses the previously unmet manufacturing challenges of matching the microfluidic footprint area to that of the photonics, and of robust bonding of microfluidic layers to biofunctionalized surfaces. We demonstrate the fabrication, in a single step, of a microfluidic layer in the recently introduced OSTE polymer, and the subsequent unassisted dry bonding of the microfluidic layer to a grating coupled silicon photonic ring resonator sensor chip. The microfluidic layer features photopatterned through holes (vias) for optical fiber probing and fluid connections, as well as molded microchannels and tube connectors, and is manufactured and subsequently bonded to a silicon sensor chip in less than 10 minutes. Combining this new microfluidic packaging method with photonic waveguide surface gratings for light coupling allows matching the size scale of microfluidics to that of current silicon photonic biosensors. To demonstrate the new method, we performed successful refractive index measurements of liquid ethanol and methanol samples, using the fabricated device. The minimum required sample volume for refractive index measurement is below one nanoliter.
We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.
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