Artificial Magnetic Conductor, AMC is introduced into RFID application to overcome the problem of metal object detection. The AMC act as the Perfect Magnetic Conductor, PMC exhibits a reflectivity of +1 (in-phase reflection). In this paper, the stacked wafers AMC structure is designed to operate at 920 MHz frequency. The proposed stacked wafers AMC is an evolution from the basic square patch AMC. By introducing different size of slots into the square patch will help to reduce the frequency hence increase the bandwidth of the reflection phase. Another method to increase the bandwidth is by increasing the thickness of the structure. For the single cell of stacked wafers AMC proposed in this paper, the simulated bandwidth is 3.5% with reduced size of 45.56% than the square AMC. An optimized structure of 3x2 stacked wafers AMC give better return loss = -21.8 dB and gain = 3.04 dB with total efficiency of 82.3%.
Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there is very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height, insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15Ghz, the effect of the geometric parameters has no significant different to the transmission performance. The thickness of the insulation between 0.1μm to 0.3μm reacted similar performance for return loss and insertion loss across all frequency
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