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On-machine and in-process surface metrology are important for quality control in manufacturing of precision surfaces. The classifications, requirements and tasks of on-machine and in-process surface metrology are addressed. The state-of-the-art on-machine and in-process measurement systems and sensor technologies are presented. Error separation algorithms for removing machine tool errors, which is specially required in on-machine and in-process surface metrology, are overviewed, followed by a discussion on calibration and traceability. Advanced techniques on sampling strategies, measurement systems-machine tools interface, data flow and analysis as well as feedbacks for compensation manufacturing are then demonstrated. Future challenges and developing trends are also discussed.

This work addresses dimensional measurements performed with the scanning electron microscope (SEM) using 3D reconstruction of surface topography through stereo-photogrammetry. The paper presents both theoretical and experimental investigations, on the effects of instrumental variables and measurement parameters on reconstruction accuracy. Investigations were performed on a novel sample, specifically developed and implemented for the tests. The description is based on the model function introduced by Piazzesi and adapted for eucentrically tilted stereopairs. Two main classes of influencing factors are recognized: the first one is related to the measurement operation and the instrument set-up; the second concerns the quality of scanned images and represents the major criticality in the application of SEMs for 3D characterizations.

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This paper aimed at identifying the error sources that occur in dimensional measurements performed using atomic force microscopy. In particular, a set of characterization techniques for errors quantification is presented. The discussion on error sources is organized in four main categories: scanning system, tip-surface interaction, environment, and data processing. The discussed errors include scaling effects, squareness errors, hysteresis, creep, tip convolution, and thermal drift. A mathematical model of the measurement system is eventually described, as a reference basis for errors characterization, with an applicative example on a reference silicon grating