Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions. The term chip scale package (CSP) has become synonymous with "fine pitch BGA" as the distinction between a ball grid array (BGA) and some chip scale packages becomes nearly indistinguishable. The cost of chip scale packages also continues to draw attention as one of the barriers to wide scale industry adoption. Sometimes lost in the chip scale debate is the discussion about wafer level chip scale packages, which offer the fastest path to small form factor, high performance and cost effective solutions. In this paper, we describe an approach to wafer level chip scale packaging that is an extension of integrated passive device processing, which results in low cost.Index Terms-Chip-scale packaging, integrated passive devices, wafer-level processing.
Although MCMs have been used for processor modules for high end computers since the 1970s, it was not until the 1990s that cost effective MCM technologies have been available for complete processor modules in workstations and other moderate cost computers. In the past 5 years, many technology improvements have enhanced the performance ancl dec;.aeased the effective cost of MCMs. Flip-chip, laminated memory, interleaved wirebonds and thin film passive networks have improved performance and packing density. Simplified packages and hybrid interconnect schemes of cofired and deposited interconnects (or laminated and deposited interconnects), as well as several of the aforementioned technologies, have further reduced cost. Case studies will show the benefits of these improvements.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.