Silicon crystallized in the usual cubic (diamond) lattice structure has dominated the electronics industry for more than half a century. However, cubic silicon (Si), germanium (Ge) and SiGe-alloys are all indirect bandgap semiconductors that cannot emit light efficiently. Accordingly, achieving efficient light emission from group-IV materials has been a holy grail 1 in silicon technology for decades and, despite tremendous efforts 2-5 , it has remained elusive 6 . Here, we demonstrate efficient light emission from direct bandgap hexagonal Ge and SiGe alloys. We measure a sub nanosecond, temperature insensitive radiative recombination lifetime and observe a similar emission yield to direct bandgap III-V semiconductors. Moreover, we demonstrate how by controlling the composition of the hexagonal SiGe alloy, the emission wavelength can be continuously tuned in a broad range, while preserving a direct bandgap. Our experimental findings are shown to be in excellent quantitative agreement with the ab initio theory. Hexagonal SiGe embodies an ideal material system to fully unite electronic and optoelectronic functionalities on a single chip, opening the way towards novel device concepts and information processing technologies.Silicon has been the workhorse of the semiconductor industry since it has many highly advantageous physical, electronic and technological properties. However, due to its indirect bandgap, silicon cannot emit light efficientlya property that has seriously constrained potential for applications to electronics and passive optical circuitry 7-9 . Silicon technology can only reach its full application potential when heterogeneously supplemented 10 with an efficient, direct bandgap light emitter.The band structure of cubic Si, presented in Fig. 1a is very well known, having the lowest conduction band (CB) minimum close to the X-point and a second lowest * These authors contributed equally to this work. † Correspondence to E.P.A.M.(e.p.a.m.bakkers@tue.nl).minimum at the L-point.As such, it is the archetypal example of an indirect bandgap semiconductor, that, notwithstanding many great efforts 3-6 , cannot be used for efficient light emission.By modifying the crystal structure from cubic to hexagonal, the symmetry along the 111 crystal direction changes fundamentally, with the consequence that the L-point bands are folded back onto the Γ-point. As shown in Fig. 1b, for hexagonal Si (Hex-Si) this results in a local CB minimum at the Γ-point, with an energy close to 1.7 eV 11-13 . Clearly, Hex-Si remains indirect since the lowest energy CB minimum is at the M-point, close to 1.1 eV. Cubic Ge also has an indirect bandgap but, unlike Si, the lowest CB minimum is situated at the L-point, as shown in Fig. 1c. As a consequence, for Hex-Ge the band folding effect results in a direct bandgap at the Γ-point with a magnitude close to 0.3 eV, as shown in the calculated band structure in Fig. 1d 14 .To investigate how the direct bandgap energy can be tuned by alloying Ge with Si, we calculated the band structures of He...

The tailoring of the physical properties of semiconductor nanomaterials by strain has been gaining increasing attention over the last years for a wide range of applications such as electronics, optoelectronics and photonics. The ability to introduce deliberate strain fields with controlled magnitude and in a reversible manner is essential for fundamental studies of novel materials and may lead to the realization of advanced multi-functional devices. A prominent approach consists in the integration of active nanomaterials, in thin epitaxial films or embedded within carrier nanomembranes, onto Pb(Mg1/3Nb2/3)O3-PbTiO3-based piezoelectric actuators, which convert electrical signals into mechanical deformation (strain). In this review, we mainly focus on recent advances in strain-tunable properties of self-assembled InAs quantum dots embedded in semiconductor nanomembranes and photonic structures. Additionally, recent works on other nanomaterials like rare-earth and metal-ion doped thin films, graphene and MoS2 or WSe2 semiconductor two-dimensional materials are also reviewed. For the sake of completeness, a comprehensive comparison between different procedures employed throughout the literature to fabricate such hybrid piezoelectric-semiconductor devices is presented. It is shown that unprocessed piezoelectric substrates (monolithic actuators) allow to obtain a certain degree of control over the nanomaterials' emission properties such as their emission energy, finestructure-splitting in self-assembled InAs quantum dots and semiconductor 2D materials, upconversion phenomena in BaTiO3 thin films or piezotronic effects in ZnS:Mn films and InAs quantum dots. Very recently, a novel class of micro-machined piezoelectric actuators have been demonstrated for a full control of in-plane stress fields in nanomembranes, which enables producing energy-tunable sources of polarization-entangled photons in arbitrary quantum dots. Future research directions and prospects are discussed.

In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

Lead-magnesium niobate lead-titanate (PMN-PT) has been proven as an excellent material for sensing and actuating applications. The fabrication of advanced ultra-small PMN-PT-based devices relies on the availability of sophisticated procedures for the micro-machining of PMN-PT thin films or bulk substrates. Approaches reported up to date include chemical etching, excimer laser ablation and ion milling. To ensure an excellent device performance, a key mandatory feature for a micro-machining process is to preserve as far as possible the crystalline quality of the substrates; in other words, the fabrication method must induce a low density of cracks and other kind of defects. In this work, we demonstrate a relatively fast procedure for the fabrication of highquality PMN-PT micro-machined actuators employing green femtosecond laser pulses. The fabricated devices feature absence of extended cracks and well defined edges with relatively low roughness, which is advantageous for the further integration of nanomaterials onto the piezoelectric actuators.1

No abstract