Fourier model–based multi-probe-error-separation is an error separation method that is useful for precise measurement of the rotation error motion of spindles or roundness profile of rotating machine parts. However, it is not yet widely used, because it suffers from the critical problem of harmonic distortion. This study explores the phenomenon of harmonic distortion in detail and analytically clarifies the principles behind its occurrence. The position at which harmonic distortion occurs can be calculated exactly and easily using principles related not only to probe arrangement angles, but also to measurement conditions such as data length and undulation range of interest. Based on these principles, we propose multi-probe system design guidelines for the effective selection of probe arrangement angles and avoidance of harmonic distortion. The reliability and usability of the proposed design method are verified by simulation tests; stable multi-probe-error-separation can easily be achieved using the proposed design technique. We conduct experimental tests using a special measuring system based on four probes composed of two different probe arrangement sets and verify that this multi-probe-error-separation method can acquire rotation error motion or roundness profile precisely without harmonic distortion.
This paper quantitatively analyzes the signal integrity and device stability issues of gate driver circuits for active matrix displays integrated with hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs), and reveals that the clock-coupling noises and threshold voltage shift due to the DC gate bias in previous gate driver circuits can seriously affect the image quality. To resolve these problems, two types of decoder-based gate driver circuits have been proposed, that can completely avoid the floating output node to prevent the clock-coupling noises without applying the DC gate bias to all the TFTs used in the gate driver circuits. The performances and characteristics of the two proposed types of gate drivers will be discussed and compared, and the experimental results for the fabricated circuits will be presented.
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