This paper presents the research on tactile sensing\ud
system on chip. The tactile sensing chips comprise of 5 5 array\ud
of Piezoelectric Oxide Semiconductor Field Effect Transistor\ud
(POSFET) devices and temperature sensors. The POSFET devices\ud
are obtained by spin coating piezoelectric polymer, poly(vinylidene\ud
fluoride-trifluoroethylene) (P(VDF-TrFE)), films directly on to the\ud
gate area of Metal Oxide Semiconductor (MOS) transistors. The\ud
tactile sensing chips are able to measure dynamic contact forces\ud
and temperatures. The readout and the data acquisition system\ud
to acquire the tactile signals are also presented. The chips have\ud
been extensively tested over wide range of dynamic contact forces\ud
and temperatures and the experimental results are presented.\ud
The paper also reports the research on tactile sensing chips with\ud
POSFET array and the integrated electronics
A single-package digital MEMS Capacitive Microphone (MCM) system is presented. The system consists of a MCM, which is wire-bonded with its readout interface (RI). The MCM sensor is fabricated using a combination of surface and bulk micromachining, employing diaphragm-stiffening to achieve piston-like diaphragm-movement and attaining required sensitivity with a smaller diaphragm-area. The RI is designed in 0.35 lm CMOS and it consists of a preamplifier (PAMP), a sigma-delta modulator (SDM), integrated biasing and digital control, converting the MCM capacitive variations into a single-bit over-sampled digital bitstream. The PAMP employs a two-terminal bootstrapped source-follower buffer to make the readout insensitive to the MCM parasitics, subsequently feeding a third-order single-loop singlebit modulator running at 2.5 MHz. The electrical measurements of the standalone RI demonstrate 55 dB A-weighted @ 1 Pa SNDR at the analog PAMP output and 80 dB A-weighted dynamic-range at the digital output, which corresponds to a conversion range from 40 to 120 dB SPL. The SNDR for acoustic measurements is 33 dB A-weighted @ 1 Pa, limited by the higher MCM thermal noise floor and reduced sensitivity (-53 dB V @ 1 Pa). The frequency characterization of the system for the complete audio-band demonstrates the effect of the system package towards higher frequencies ([9 kHz), giving rise to Helmholtz resonance, and reduction in sensitivity for low-frequencies (\400 Hz) because of acoustic short-circuiting inside the MCM due to flow-by slots. The complete system consumes 460 lA of total current for a 1.8 V single-supply. The total system dimensions are 4.5 9 2 mm 2 (excluding the package), demonstrating the viability of a low-area, low-power and high dynamic-range implementation of digital MCM.
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