An indium tin oxide (ITO) layer on a lime glass substrate for flat panel displays has been patterned without a mask by scanning Nd:YLF (neodymium-doped yttrium-lithium-fluoride) laser irradiation in a pulsed mode. Both fundamental and frequency doubled lines of 1.047 μm and 523.5 nm were compared for processing. SEM (scanning electron microscopy) and surface stylus observation revealed that only the top ITO layer could be removed without substrate etching. A finer patterning was possible for irradiation of a 523.5 nm line because of the better focusing feature, though higher laser energy density was required for this line than for a 1.047 μm line because of the lower light absorption.
In this paper we present a technology developed for reliable electrical interconnection on film substrates and between vertically stacked film layers. Applying through-hole via technologies for 3D foil stacks enables multi-functionality and RF performance combined with open form-factor and very cost-efficient manufacturing of conformable electronic modules. The manufacture of fine line metal patterns (line /space geometries below 20μm) on film substrates is performed by cost-effective roll-to-roll technology. Furthermore procedures and technologies for handling and lamination of film based sub-modules have been developed. Also the manufacture and handling of ultra-thin and flexible integrated circuits has been combined with placement of SMD type passive and with integrated printed passive components in the same technology
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