Adhesion energy and bonding wave velocity are key parameters that should be controlled in an industrial direct bonding process because it reports what exactly occurs at the time of the bonding. While dynamics of the bonding front has been analytically studied and modelled [1-4], the literature gives not much information about its characterization. This study is then focused on adhesion energy (Ea) and bonding wave velocity (Vo) measurement. After considerations about immediate and stabilized adhesion energy, we will show the dependence between Ea and Vo and we will confirm Rieutord’s model [1] for hydrophilic direct bonding. Roughness dependence, plasma pre-treatment, hydrophobic direct bonding and re-bonding will also be discussed.

No abstract

We have developed field-emission-display technology driven by chemical-vapordeposition-grown carbon-nanotube emitters incorporated in a simple, low-cost device structure. Here, we report on frit-sealed test displays with a brightness of 3000 cd/m 2 at 3 kV and a lifetime of 9000 hours with only 45% degradation. We also demonstrate the scalability of the technology with a uniform high-brightness 6-in. QVGA that displays video images with a switching voltage of 40 V. FIGURE 1 -Cross section of the cathode structure.FIGURE 2 -SEM view of part of a cathode which shows pads covered with CNTs in between the gates.