A water jet assisted laser composite processing device was used to study the influence of the laser input current and low-speed jet to etching amount .It established a empirical formula for relationship between the input current and the etching amount. Tests showed: under certain water speed, as the laser input current increased , the amount of etching was also increased; and when the current was constant, the jet speed was 25.9m/s, the etching amount reached a peak. This test also analyzed the factors that influenced the etching amount of water jets.
A wavelength of 1064nm Nd: YAG laser was used to groove on silicon, then studying the affect of quality and processing efficiency by incoming jet in laser etching course of silicon: Water jet reduced doss, cracks and other defects which might be produced on the surface of groove. Software of matlab was used to restore the topography of tank’s bottom; analysis shown that the water jet had a scouring effect influence on tank’s bottom. Introduction of the water jet caused the loss of the laser energy, but it could improve processing efficiency indirectly by blowing away the slag.
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