In this study, a further investigation was carried out on the synthesis mechanism, optimal manufacturing conditions, and curing behavior of a sucrose-ammonium dihydrogen phosphate (SADP) adhesive. The results of 13C nuclear magnetic resonance (NMR) spectroscopy confirmed that SADP was composed of 5-hydroxymethylfurfural (5-HMF), deoxyfructosazine (DOF), amino compounds, Schiff base, monosaccharides, and oligosaccharide. The optimal hot-pressing conditions were a hot-pressing temperature of 170 °C, a hot-pressing time of 7 min, and a spread rate of 120 g/m2. The wet shear strength of plywood bonded at optimal manufacturing conditions met the requirements of China National Standard (GB/T 9846-2015). Thermal analysis and insoluble mass proportion measurements showed that the main curing behavior of the SADP adhesive occurred at curing temperatures higher than 145 °C, and more than 50% insoluble mass was formed when the heating time was longer than 5 min. Fourier-transform infrared spectroscopy (FT-IR) indicated that cross-linking of the cured adhesive was promoted by prolonging the heating time. In addition, pyrolysis gas chromatography and mass spectrometry (Py-GC/MS) confirmed that the cured SADP adhesive was composed of furan and nitrogen-containing compounds.
The most commonly used curing agents for soybased adhesives are polyamines, which have the problem of low solid content and/or high viscosity. To overcome this problem, a new type of polyamidoamine (PADA) resin was synthesized and applied to soy flour-based adhesives to improve their water resistance. The PADA solution obtained had a high solid content of 50 wt% and low viscosity of 270 cP. The optimum weight ratio of soy flour/ PADA/maleic anhydride to prepare adhesive was 40/7/1.68. The wet strength of plywood prepared at the optimum weight ratio was 0.82 MPa, which meant the plywood could be used as type II plywood according to the Chinese National Standard GB/T 9846.7-2004. The results of waterinsoluble solid content measurement and SEM observation demonstrated that cured soy flour-PADA-maleic anhydride adhesive had a 16 % greater water-insoluble solid content than soy flour-NaOH adhesive. The cross-linking network formed by the reactions of PADA and MA would increase the water-insoluble solid contents and improve water resistance of cured soy flour-based adhesives.
Bamboo delignification is a common method for studying its functional value-added applications. In this study, bamboo samples were delignified by treatment with sodium chlorite. The effects of this treatment on the bamboo’s microstructure, surface chemical composition, and pyrolysis behaviour were evaluated. Field-emission scanning electron microscopy (FE-SEM), Fourier-transform infrared (FTIR) spectroscopy, X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were conducted to evaluate these parameters. The FTIR results demonstrated that the lignin peak decreased or disappeared, and some hemicellulose peaks decreased, indicating that sodium chlorite treatment effectively removed lignin and partly decomposed hemicellulose, although cellulose was less affected. The XPS results showed that, after treatment, the oxygen-to-carbon atomic ratio of delignified bamboo increased from 0.34 to 0.45, indicating a lack of lignin. XRD revealed increased crystallinity in delignified bamboo. Further pyrolysis analysis of treated and untreated bamboo showed that, although the pyrolysis stage of the delignified bamboo did not change, the maximum thermal degradation rate (Rmax) and its corresponding temperature (from 353.78 to 315.62 °C) decreased significantly, indicating that the pyrolysis intensity of the bamboo was weakened after delignification. Overall, this study showed that delignified bamboo develops loose surfaces, increased pores, and noticeable fibres, indicating that alkali-treated bamboo has promising application potential due to its novel and specific functionalities.
Purpose
The purpose of this paper is to prepare a water-resistant adhesive (SA) from soy flour (SF) with less water-soluble components.
Design/methodology/approach
Defatted SF was suspended and stirred in water. Then, the pH of dispersion was adjusted to a predetermined value (i.e. 8, 9 or 10) by the addition of 2M sodium hydroxide (NaOH) solution. After stirring at a predetermined temperature (25°C, 35°C, 45°C) for different time (1 h, 2 h, 3 h), the 2M hydrochloric acid (HCl) solution was added in a dropwise manner into the dispersion until the pH value was adjusted to 4.5. Then, the dispersion was centrifuged at 6,000 rpm for 2 min. The obtained precipitate with less water-soluble components was used as an adhesive (SA) directly.
Findings
SA had a wet strength of 1.02 MPa when used for the fabrication of poplar plywood. Polyvinyl alcohol (PVA) solution was applied to improve the tack of SAs to wood surface and the viscosities of SAs were decreased from 10,200 cP to 4,100 cP at room temperature after the PVA addition. The soy proteins in SAs were not denatured to a large extent according to the differential scanning calorimetry and light microscopy. The remained multilevel structures of soy protein played a positive contribution to the water resistance of SAs, and the bond lines of cured SAs were much more stable than those of the cured SF and soy protein concentrate (SPC).
Research limitations/implications
The fluidity and solid content of soy adhesives is much lower than formaldehyde adhesives. Further investigations are needed to improve the fluidity of soy adhesives with high solid contents.
Originality/value
Novel water-resistant soy adhesives were provided.
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