Abstract:The most commonly used curing agents for soybased adhesives are polyamines, which have the problem of low solid content and/or high viscosity. To overcome this problem, a new type of polyamidoamine (PADA) resin was synthesized and applied to soy flour-based adhesives to improve their water resistance. The PADA solution obtained had a high solid content of 50 wt% and low viscosity of 270 cP. The optimum weight ratio of soy flour/ PADA/maleic anhydride to prepare adhesive was 40/7/1.68. The wet strength of plywo… Show more
“…These microstructural features of unbonded surfaces of the four wood species in Figure 2 were similar to those of pine, birch, poplar, and walnut reported earlier. [12,13,22] As per the mechanism proposed by Gent and Li [23], we believed that the high roughness on the unbonded Douglas fir wood surface along with tipping and cracking characteristics enhanced mechanical interlocking between the wood fibers and the adhesive slurry which contributed to the highest wood adhesion that we observed. The SEM image of the bonded Douglas fir wood further confirmed this by the observed fiber splitting features of the pulled-off surface.…”
a usda-ars, southern regional research center, usda agricultural research service, new orleans, la, usa; b usda-ars, eastern regional research center, Wyndmoor, Pa, usa
“…These microstructural features of unbonded surfaces of the four wood species in Figure 2 were similar to those of pine, birch, poplar, and walnut reported earlier. [12,13,22] As per the mechanism proposed by Gent and Li [23], we believed that the high roughness on the unbonded Douglas fir wood surface along with tipping and cracking characteristics enhanced mechanical interlocking between the wood fibers and the adhesive slurry which contributed to the highest wood adhesion that we observed. The SEM image of the bonded Douglas fir wood further confirmed this by the observed fiber splitting features of the pulled-off surface.…”
a usda-ars, southern regional research center, usda agricultural research service, new orleans, la, usa; b usda-ars, eastern regional research center, Wyndmoor, Pa, usa
“…Although this approach is most widely used (e.g., 4,6,9,11 ), more complicated or multiple overlapped wood specimens have also be used in the adhesive tests (e.g., two 2-layer joints with three wood strips 7,22 , and three 3-layer joints with three wood strips) 29 .…”
Recently, the interest in plant seed meal-based products as wood adhesives has steadily increased, as these plant raw materials are considered renewable and environment-friendly. These natural products may serve as alternatives to petroleum-based adhesives to ease environmental and sustainability concerns. This work demonstrates the preparation and testing of the plant seed-based wood adhesives using cottonseed and soy meal as raw materials. In addition to untreated meals, water washed meals and protein isolates are prepared and tested. Adhesive slurries are prepared by mixing a freeze-dried meal product with deionized water (3:25 w/w) for 2 hr. Each adhesive preparation is applied to one end of 2 wood veneer strips using a brush. The tacky adhesive coated areas of the wood veneer strips are lapped and glued by hot-pressing. Adhesive strength is reported as the shear strength of the bonded wood specimen at break. Water resistance of the adhesives is measured by the change in shear strength of the bonded wood specimens at break after water soaking. This protocol allows one to assess plant seed-based agricultural products as suitable candidates for substitution of synthetic-based wood adhesives. Adjustments to the adhesive formulation with or without additives and bonding conditions could optimize their adhesive properties for various practical applications.
Video LinkThe video component of this article can be found at
“…The results showed that a polyamine solution which had a solid content of 40-60% and a viscosity of less than 600 cP was preferable to prepare soy-based adhesives [32]. To solve the problems of low-solid content and high viscosity of curing agents, our group synthesized a new type of polyamidoamine (PADA) resin [34] for producing soy flour-based adhesives ( Figure 4). The obtained PADA solution had high-solid content of 50 wt% and low viscosity of 270 cP.…”
Section: Adhesives -Applications and Propertiesmentioning
Soy-based adhesives have been regarded as the most suitable candidates for wood industry. For a widespread use of soy-based adhesives, new technologies need to be developed to improve the water resistance. An overview on the methods to improve water resistance of soy-based adhesives is presented. Denaturants were once considered necessary to modify soy protein. However, water-resistant soy adhesives could be prepared by simply removing water-soluble carbohydrates and low molecular peptides from soy flour. In addition, proper grafting and cross-linking agents help to prepare water-resistant soy-based adhesives, which are used widely to bond interior wood composites. In particular, a new type of polyamidoamine (PADA) resin and an itaconic acid-based polyamidoamine-epichlorohydrin (IA-PAE) resin were synthesized to perform as cross-linking agents for soy-based adhesives. This review concludes that soybased adhesives have great potential for use in numerous applications. However, future work is still needed to make soy-based adhesives more competitive with synthetic adhesives.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.