No abstract

Cu 2 O thin films were electrodeposited from a Cu(II) acetate solution containing 0.02 M Copper(II) acetate (Cu(OAc) 2 ) and 0.1 Msodium acetate (NaOAc) at pH 5.6, using three different working conductive electrodes with approximately the same square resistance -indium doped tin oxide glass (ITO/Glass), fluorine-doped tin oxide glass (FTO/Glass), and Indium doped tin oxide Polyethylene terephthalate (ITO/PET)-under identical conditions using a common growth condition. The Cu 2 O thin films werecharacterized by means ofscanning electron microscopy (SEM), x-raydiffraction (XRD),current density versus growth time for Cu 2 O films, and electrochemical impedance spectroscopy (EIS). The results showed that the choice of substratematerials hasa crucial role in controlling of Cu 2 O growth. The charge transfer resistance (Rct) of FTO/Glass-Cu 2 O exhibits the lowest value; this means that FTO/Glass-Cu 2 O possess the highest electron transfer efficiency.All Cu 2 O films showed n-type semiconductor characteristic with charge carrier densities varying between 1.4 × 10 18 -1.2 × 10 19 cm −3 .

A novel foaming process-chemical foaming process (CFP)-using foaming agents to fabricate wafer-level micro glass cavities including channels and bubbles was investigated. The process consists of the following steps sequentially: (1) shallow cavities were fabricated by a wet etching on a silicon wafer; (2) powders of a proper foaming agent were placed in a silicon cavity, named 'mother cavity', on the etched silicon surface; (3) the silicon cavities were sealed with a glass wafer by anodic bonding; (4) the bonded wafers were heated to above the softening point of the glass, and baked for several minutes, when the gas released by the decomposition of the foaming agent in the 'mother cavity' went into the other sealed interconnected silicon cavities to foam the softened glass into cylindrical channels named 'daughter channels', or spherical bubbles named 'son bubbles'. Results showed that wafer-level micro glass cavities with smooth wall surfaces were achieved successfully without contamination by the CFP. A model for the CFP was proposed to predict the final shape of the glass cavity. Experimental results corresponded with model predictions. The CFP provides a low-cost avenue to preparation of micro glass cavities of high quality for applications such as micro-reactors, micro total analysis systems (μTAS), analytical and bio-analytical applications, and MEMS packaging.

A BODIPY–Se probe could track lysosome and detect lysosomal H2O2 in living cells.

A bulge testing system capable of applying static and dynamic loads to thin film membranes is described. The bulge tester consists of a sealed cavity, filled with a fluid, bounded on the bottom by a circular stainless steel diaphragm and on the top by the thin film membrane of interest. An actuator is used to apply either a static or a periodic force to the stainless steel diaphragm. The force is transmitted through the water to the thin film membrane. This facility provides for both accelerated lifetime testing and simulated service environment testing. The thin film membranes tested are composite stacks consisting of thin films of silicon, glass, metallic electrodes, and lead-zirconate-titanate. Pressure and deflection of a membrane are acquired simultaneously during loading. An image capture system coupled with an interferometer provides the means to capture interferograms of deflected membranes during both static and dynamic testing conditions. Images are then postprocessed to construct deflection versus pressure relationships, which can be used to extract materials’ properties. Accelerated lifetime testing is performed by subjecting the thin film membranes to cyclic loading at strain levels 45%–90% of the static failure strains. In simulated service environment testing thin film membranes are subjected to cyclic loading over a range of frequencies. For a given applied force, as the resonant frequency is approached the dynamic behavior of the thin film structures vary significantly from that observed for static loading. At resonance the deflection of a thin film membrane is almost three times that of a statically deflected membrane subjected to the same applied force.

Purpose -The purpose of this paper is to describe the stability and properties of the direct metal laser fabrication (DMLF) process, by putting forward top surface quality (TSQ), which could be a unique and crucially important feature compared with traditional manufacturing methods. Design/methodology/approach -Through the systematic and detailed analysis of DMLF process using related theories of additive manufacturing technologies, it was revealed that TSQ was the key factor for controlling the stability of DMLF process and thus tailoring final properties of metallic parts. Only good TSQ can ensure the stability of DMLF process and excellent performance of metal parts in theory.Findings -TSQ was defined as the surface morphology in macro and micro scopes in laser scanning area of unit layers during DMLF, and could be characterized by three key elements: flatness, compactness and cleanliness. The flatness was the significant factor to assure the shaping during DMLF, while the compactness and cleanliness were the decisive factors to assure the final properties of metal part for DMLF. As an example, the typical top surface defects and their contributing factors in DMLF for Cu-based metal powder mixtures were investigated thoroughly according to the proposed definition and requirements. Moreover, the specific controlling methods of TSQ were provided and discussed. Eventually, DMLF of three-dimensional Cu-based metal sample with complicate structure was successfully performed by taking some effective measures for adjusting TSQ parameters. Originality/value -Few comprehensive investigations have been carried out on this topic. The definition and evaluation methods of TSQ for DMLF have been introduced for the first time in the present paper.

The chemodosimeter is an off–on TPEF probe for detecting NaOCl selectively with red emission.

Double gain, a bipolar feature NIR iridium(iii) complex with both hole and electron transporting group to improve the OLED performance.