Preparation of wafer-level glass cavities by a low-cost chemical foaming process (CFP)

Shang, Jintang; Chen, Boyin; Lin, Wei; Wong, Ching‐Ping; Zhang, Di; Xu, Chao; Liu, Junwen; Huang, Qing‐An

doi:10.1039/c0lc00708k

Cited by 38 publications

(12 citation statements)

References 17 publications

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“…Wafer-level hemispherical glass bubble arrays were prepared by a controllable CFP and used as transparent packaging caps [20]. A glass wafer with conductive metal vias was used as the transparent hostess packaging substrate.…”

Section: Resultsmentioning

confidence: 99%

“…The top of the hermetic package was spherical glass bubble arrays obtained by a CFP [20], [25], which is shown in Fig. 2(e)-(g).…”

Section: B Preparation Of Spherical Glass Bubble Arraysmentioning

confidence: 99%

“…Wafer-level glass bubble arrays used as the transparent packaging caps were fabricated by a CFP [20]. The glass bubbles were designed carefully to form hemispherical bubbles according to optical designs based on the thermal decomposition of foaming agents including titanium hydride, as shown in Fig.…”

Section: B Hemispherical Glass Bubbles For Packaging Capmentioning

confidence: 99%

“…The upper half part of the package was wafer-level hemispherical glass bubble arrays prepared by a controllable process combining a hot forming process and a chemical foaming process (CFP) [20], [25]. The lower half part of the package was a glass wafer with conductive metal vias.…”

Section: Introductionmentioning

confidence: 99%

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Wafer-Level Hermetic All-Glass Packaging for Microalkali Vapor Cells of Chip-Scale Atomic Devices

Gan

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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To maintain a controllable environment for microalkali vapor cells of high-performance chip-scale atomic devices, a novel wafer-level hermetic all-glass packaging technology for microalkali vapor cells of atomic devices was investigated. A glass wafer with metal vias was used as the substrate to host the miroalkali vapor cells. Wafer-level hemispherical glass bubbles prepared by a chemical foaming process were used as transparent packaging caps. The performance of the rubidium vapor cell in the all-glass hermetic package was characterized by a laser frequency locking system and an ultraviolet spectrophotometer. The results show that hermetic all-glass packaging at a wafer level was demonstrated successfully. The results also indicate that after the hermetic all-glass packaging, the temperature variation of the microalkali vapor cells was controllably below 0.2°C at different working temperatures of atomic devices. A chip-scale atomic magnetometer using the hermetic all-glass micro vapor cell was demonstrated eventually. IndexTerms-Atomic devices, chemical foaming process (CFP), hot forming process, microrubidium vapor cell, optically pumped atomic magnetometer, ultraviolet spectrophotometer, wafer-level hermetic package.

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Section: Resultsmentioning

confidence: 99%

“…The top of the hermetic package was spherical glass bubble arrays obtained by a CFP [20], [25], which is shown in Fig. 2(e)-(g).…”

Section: B Preparation Of Spherical Glass Bubble Arraysmentioning

confidence: 99%

Section: B Hemispherical Glass Bubbles For Packaging Capmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Wafer-Level Hermetic All-Glass Packaging for Microalkali Vapor Cells of Chip-Scale Atomic Devices

Gan

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Today, they are finding applications and implications in numerous areas of daily interactions spanning several disciplines, including engineering, environmental, food and healthcare sciences [1][2][3]. Often overlooked and seen as being of little significance, bubbles also occur naturally in several environments such as oceans and volcanoes [4,5].…”

Section: Introductionmentioning

confidence: 99%

Bioinspired bubble design for particle generation

Gündüz

Ahmad

Stride

et al. 2011

J. R. Soc. Interface.

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In this study, we devise a method to generate homogeneous particles from a bubble suspension, with the capability to control loading and the structure of bubbles. Ideally, a process such as this would occur at the interface between daughter bubble formation (instant) and gaseous diffusion (gradual). Interestingly, the budding mechanism in micro-organisms is one that demonstrates features of the desired phenomena (although at a much slower rate), as viruses can eject and evolve structures from their membranes. With these natural concepts, a bubble's surface can also be made to serve as a platform for particle generation, which transfers significant elements from the initial bubble coating to the newly generated structures. Here, we illustrate this by preparing coated bubbles (approx. 150 mm in diameter) using a hydrophobic polymer, which may be comparable to naturally occurring bubble coatings (e.g. organic matter forming part of bubble coatings in the sea), and dye (which can demonstrate entrapment of smaller quantities of a desired moiety) and then observe particle generation (approx. 500 nm). The process, which may be driven by a polymerosome-forming mechanism, also illustrates how additional uniform sub-micrometre-scale structures may form from a bubble's surface, which may have also previously been attributed to gas diffusion. In addition, such methods of particle formation from a bubble structure, the incorporation of chemical or biological media via an in situ process and subsequent release technologies have several areas of interest across the broad scientific community.

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