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Cu 2 O thin films were electrodeposited from a Cu(II) acetate solution containing 0.02 M Copper(II) acetate (Cu(OAc) 2 ) and 0.1 Msodium acetate (NaOAc) at pH 5.6, using three different working conductive electrodes with approximately the same square resistance -indium doped tin oxide glass (ITO/Glass), fluorine-doped tin oxide glass (FTO/Glass), and Indium doped tin oxide Polyethylene terephthalate (ITO/PET)-under identical conditions using a common growth condition. The Cu 2 O thin films werecharacterized by means ofscanning electron microscopy (SEM), x-raydiffraction (XRD),current density versus growth time for Cu 2 O films, and electrochemical impedance spectroscopy (EIS). The results showed that the choice of substratematerials hasa crucial role in controlling of Cu 2 O growth. The charge transfer resistance (Rct) of FTO/Glass-Cu 2 O exhibits the lowest value; this means that FTO/Glass-Cu 2 O possess the highest electron transfer efficiency.All Cu 2 O films showed n-type semiconductor characteristic with charge carrier densities varying between 1.4 × 10 18 -1.2 × 10 19 cm −3 .

A novel foaming process-chemical foaming process (CFP)-using foaming agents to fabricate wafer-level micro glass cavities including channels and bubbles was investigated. The process consists of the following steps sequentially: (1) shallow cavities were fabricated by a wet etching on a silicon wafer; (2) powders of a proper foaming agent were placed in a silicon cavity, named 'mother cavity', on the etched silicon surface; (3) the silicon cavities were sealed with a glass wafer by anodic bonding; (4) the bonded wafers were heated to above the softening point of the glass, and baked for several minutes, when the gas released by the decomposition of the foaming agent in the 'mother cavity' went into the other sealed interconnected silicon cavities to foam the softened glass into cylindrical channels named 'daughter channels', or spherical bubbles named 'son bubbles'. Results showed that wafer-level micro glass cavities with smooth wall surfaces were achieved successfully without contamination by the CFP. A model for the CFP was proposed to predict the final shape of the glass cavity. Experimental results corresponded with model predictions. The CFP provides a low-cost avenue to preparation of micro glass cavities of high quality for applications such as micro-reactors, micro total analysis systems (μTAS), analytical and bio-analytical applications, and MEMS packaging.

A BODIPY–Se probe could track lysosome and detect lysosomal H2O2 in living cells.

A bulge testing system capable of applying static and dynamic loads to thin film membranes is described. The bulge tester consists of a sealed cavity, filled with a fluid, bounded on the bottom by a circular stainless steel diaphragm and on the top by the thin film membrane of interest. An actuator is used to apply either a static or a periodic force to the stainless steel diaphragm. The force is transmitted through the water to the thin film membrane. This facility provides for both accelerated lifetime testing and simulated service environment testing. The thin film membranes tested are composite stacks consisting of thin films of silicon, glass, metallic electrodes, and lead-zirconate-titanate. Pressure and deflection of a membrane are acquired simultaneously during loading. An image capture system coupled with an interferometer provides the means to capture interferograms of deflected membranes during both static and dynamic testing conditions. Images are then postprocessed to construct deflection versus pressure relationships, which can be used to extract materials’ properties. Accelerated lifetime testing is performed by subjecting the thin film membranes to cyclic loading at strain levels 45%–90% of the static failure strains. In simulated service environment testing thin film membranes are subjected to cyclic loading over a range of frequencies. For a given applied force, as the resonant frequency is approached the dynamic behavior of the thin film structures vary significantly from that observed for static loading. At resonance the deflection of a thin film membrane is almost three times that of a statically deflected membrane subjected to the same applied force.