Although MCMs have been used for processor modules for high end computers since the 1970s, it was not until the 1990s that cost effective MCM technologies have been available for complete processor modules in workstations and other moderate cost computers. In the past 5 years, many technology improvements have enhanced the performance ancl dec;.aeased the effective cost of MCMs. Flip-chip, laminated memory, interleaved wirebonds and thin film passive networks have improved performance and packing density. Simplified packages and hybrid interconnect schemes of cofired and deposited interconnects (or laminated and deposited interconnects), as well as several of the aforementioned technologies, have further reduced cost. Case studies will show the benefits of these improvements.
MCM-D technologies can be used to meetthe challenges of designing high performance mixed signal MCMs. Available MCM-D technologies offer special features such as high density wirebonding, high density interconnect, and integral passive components. These features allow designers to optimize key mixed signal performance parameters such as isolation, insertion loss, return loss, and noise. Specific design examples illustrate the impact o f a specific silicon circuit board based MCM-D technology on these performance parameters.
I n order to obtain higher density and lower cost Multi-Chip Module(MCM), we have developed a simple structured bare-die stacking assembly technology. It provides a simple structure with thick epoxy layer to f i x upper layer bare-die, instead of custom structures such as notched dies or additional electrodes at die edge in the conventional ones. The developed technology can use exactly the same dies as those f o r wire bonding interconnection without any additional processing. All electrical connections of the upper and the lower dies are achieved by wire-bonding to the substrate independently. We have performed this stacking assembly by precise control of epoxy layer thickness and wire loop shapes.This new technology was applied to the production of MCM including twelve memory dies. The assembled MCM was almost twice as dense as an MCM without a stacked-die structure. The MCM were verified to functional correctly. The assembly yield of MCM with this structure was high enough f o r production. Because our technology includes a repairing way f o r failed dies, a fully tested KGD (Known Good Dies) are not necessary.
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