I n order to obtain higher density and lower cost Multi-Chip Module(MCM), we have developed a simple structured bare-die stacking assembly technology. It provides a simple structure with thick epoxy layer to f i x upper layer bare-die, instead of custom structures such as notched dies or additional electrodes at die edge in the conventional ones. The developed technology can use exactly the same dies as those f o r wire bonding interconnection without any additional processing. All electrical connections of the upper and the lower dies are achieved by wire-bonding to the substrate independently. We have performed this stacking assembly by precise control of epoxy layer thickness and wire loop shapes.This new technology was applied to the production of MCM including twelve memory dies. The assembled MCM was almost twice as dense as an MCM without a stacked-die structure. The MCM were verified to functional correctly. The assembly yield of MCM with this structure was high enough f o r production. Because our technology includes a repairing way f o r failed dies, a fully tested KGD (Known Good Dies) are not necessary.
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