The effect of sputtering current that flow in a carbon rod on the structural and transport properties of Si-C junction is studied. Si-C junction is fabricated by plasma sputtering in Argon gas atmosphere without catalysts with thickness of 20, 40 and 60 nm. Images of the specimen by scanning electron microscope (SEM) and atomic force microscope (AFM) show that the carbon layer is as carbon nanotubes with diameters about 20-30 nm. X-ray and Raman spectrums show peak characteristics of the carbon nanotubes, the G and D bands appear for all thicknesses indicating free of defect carbon nanotubes. Two parameters about the thickness of the carbon layer and the sputtering current for different thicknesses and currents were studied. Nanotubes evidence was clear. We noticed that the sputtering current and thickness of layers affect the structure of CNT layer leading to the formation of grains. Increasing plasma current led to decrease grain formation however increasing thickness ends to increase grain size; moreover it led to amorphous structure formation and this was proved through X-ray, Raman spectra and AFM images.

Chemical bath deposition was used to prepare thin films of ZnTe. The density of compounds (0.5-2) ml in 50 ml of distilled water, the precipitation time (10-80 min), and the solution temperature during the precipitation process (15-85 C) have been changed during the preparation of the ZnTe thin films to get the optimal deposition conditions of a semiconductor. The effect of these parameters has been determined by studying the optical properties of the films which included the transmittance and absorbance as a function of the wavelength and energy gap. The energy gap remains constant at about 2.7 eV over all precipitation times for each density of compound. We have also found that the energy gap of the films decreases with increasing solution temperature, reaching approximately 2.9-3eV at 15 C and decreasing to 2.4 eV at 85 C.

The research studies the effect of the distance between the sample and the plasma sputtering source on the properties of the junction (silicon wafer-carbon nanotubes). The silicon wafer is fixed at (near, medium and far distances from the plasma source which is in the form of high purity graphite rod heated electrically). For the three cases, thickness of the sample is constant (20 nm). The samples were studied by scanning electron (SEM) and atomic force microscopes (AFM), X-ray and Raman spectra. For optimum distances the carbon layer is in the form of multi wall carbon nanotube (MWCNT). SEM images shows no formation of CNT on the Si wafer for near distance, which is consistent with the AFM images, X-ray and Raman spectrograms and no existence of characteristics (002) peaks whereas it appears for medium and longer distances, and by experience the optimum distance was found. This means that at closer distance high energy and high intensity plasma particles prevent the formation of CNT. This effect decreases with increasing distance of substrate from the graphite rod.

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