Undoped and Ga-and Al-doped ZnO films were synthesized using sol-gel and spin coating methods and characterized by X-ray diffraction, high-resolution scanning electron microscopy (SEM), optical spectroscopy and Hall-effect measurements. SEM measurements reveal an average grain size of 20 nm and distinct individual layer structure. Measurable conductivity was not detected in the unprocessed films; however , annealing in hydrogen or zinc environment induced significant conductivity (∼10 −2 Ω.cm) in most films. Positron annihilation spectroscopy measurements provided strong evidence that the significant enhancement in conductivity was due to hydrogen passivation of Zn vacancy related defects or elimination of Zn vacancies by Zn interstitials which suppress their role as deep acceptors. Hydrogen passivation of cation vacancies is shown to play an important role in tuning the electrical conductivity of ZnO, similar to its role in passivation of defects at the Si/SiO2 interface that has been essential for the successful development of complementary metal-oxide-semiconductor (CMOS) devices. By comparison with hydrogen effect on other oxides, we suggest that hydrogen may play a universal role in oxides passivating cation vacancies and modifying their electronic properties. © 2016 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license
The optical properties of a high quality bulk ZnO, thermally post treated in a forming gas environment are investigated by temperature dependent continuous wave and time-resolved photoluminescence (PL) measurements. Several bound and free exciton transitions along with their first excited states have been observed at low temperatures, with the main neutral-donor-bound exciton peak at 3.3605 eV having a linewidth of 0.7 meV and dominating the PL spectrum at 10 K. This bound exciton transition was visible only below 150 K, whereas the A-free exciton transition at 3.3771 eV persisted up to room temperature. A-free exciton binding energy of 60 meV is obtained from the position of the excited states of the free excitons. Additional intrinsic and extrinsic fine structures such as polariton, two-electron satellites, donor-acceptor pair transitions, and longitudinal optical-phonon replicas have also been observed and investigated in detail. Time-resolved PL measurements at room temperature reveal a biexponential decay behavior with typical decay constants of ϳ170 and ϳ864 ps for the as-grown sample. Thermal treatment is observed to increase the carrier lifetimes when performed in a forming gas environment.
We report the growth of GaN films on the Si(111) substrate by metalorganic chemical vapour phase deposition (MOCVD). Different buffer layers were used to investigate their effects on the structural and optical properties of GaN layers. A series of GaN layers were grown on Si(111) with different buffer layers and buffer thicknesses and were characterized by Nomarski microscopy, atomic force microscopy, high-resolution x-ray diffraction (XRD) and photoluminescence (PL) measurements. We first discuss the optimization of the LT-AlN/HT-AlN/Si(111) templates and then the optimization of the graded AlGaN intermediate layers. In order to prevent stress relaxation, step-graded AlGaN layers were introduced along with a crack-free GaN layer of thickness exceeding 2.6µm. The XRD and PL measurements results confirmed that a wurtzite GaN was successfully grown. The resulting GaN film surfaces were flat, mirror-like and crack-free. The mosaic structure in the GaN layers was investigated. With a combination of Williamson-Hall measurements and the fitting of twist angles, it was found that the buffer thickness determines the lateral coherence length, vertical coherence length, as well as the tilt and twist of the mosaic blocks in GaN films. The PL spectra at 8K show that a strong band edge photoluminescence of GaN on Si (111) emits light at an energy of 3.449eV with a full width at half maximum (FWHM) of approximately 16meV. At room temperature, the peak position and FWHM of this emission become 3.390eV and 58meV, respectively. The origin of this peak was attributed to the neutral donor bound exciton. It was found that the optimized total thickness of the AlN and graded AlGaN layers played a very important role in the improvement of quality and in turn reduced the cracks during the growth of GaN/Si(111) epitaxial layers. (Some figures in this article are in colour only in the electronic version) J. Phys. D: Appl. Phys. 41 (2008) 155317 E Arslan et al 2
Stimulated emission ͑SE͒ was measured from ZnO thin films grown on c-plane sapphire by rf sputtering. Free exciton transitions were clearly observed at 10 K in the photoluminescence ͑PL͒, transmission, and reflection spectra of the sample annealed at 950°C. SE resulting from both exciton-exciton scattering and electron hole plasma formation was observed in the annealed samples at moderate excitation energy densities. The SE threshold energy density decreased with increasing annealing temperature up to ϳ950°C. The observation of low threshold exciton-exciton scattering-induced SE showed that excitonic laser action could be obtained in rf-sputtered ZnO thin films. At excitation densities below the SE threshold, time-resolved PL revealed very fast recombination times of ϳ74 ps at room temperature, and no significant change at 85 K. The decay time for the SE-induced PL was below the system resolution of Ͻ45 ps.
The transport properties of high mobility AlGaN/AlN/GaN and high sheet electron density AlInN/ AlN/GaN two-dimensional electron gas ͑2DEG͒ heterostructures were studied. The samples were grown by metal-organic chemical vapor deposition on c-plane sapphire substrates. The room temperature electron mobility was measured as 1700 cm 2 / V s along with 8.44ϫ 10 12 cm −2 electron density, which resulted in a two-dimensional sheet resistance of 435 ⍀ / ᮀ for the Al 0.2 Ga 0.8 N / AlN/ GaN heterostructure. The sample designed with an Al 0.88 In 0.12 N barrier exhibited very high sheet electron density of 4.23ϫ 10 13 cm −2 with a corresponding electron mobility of 812 cm 2 / V s at room temperature. A record two-dimensional sheet resistance of 182 ⍀ / ᮀ was obtained in the respective sample. In order to understand the observed transport properties, various scattering mechanisms such as acoustic and optical phonons, interface roughness, and alloy disordering were included in the theoretical model that was applied to the temperature dependent mobility data. It was found that the interface roughness scattering in turn reduces the room temperature mobility of the Al 0.88 In 0.12 N / AlN/ GaN heterostructure. The observed high 2DEG density was attributed to the larger polarization fields that exist in the sample with an Al 0.88 In 0.12 N barrier layer. From these analyses, it can be argued that the AlInN/AlN/GaN high electron mobility transistors ͑HEMTs͒, after further optimization of the growth and design parameters, could show better transistor performance compared to AlGaN/AlN/GaN based HEMTs.
ZnO is considered as a promising substrate for GaN epitaxy because of stacking match and close lattice match to GaN. Traditionally, however, it suffered from poor surface preparation which hampered epitaxial growth in general and GaN in particular. In this work, ZnO substrates with atomically flat and terrace-like features were attained by annealing at high temperature in air. GaN epitaxial layers on such thermally treated basal plane ZnO with Zn and O polarity have been grown by molecular beam epitaxy, and two-dimensional growth mode was achieved as indicated by reflection high-energy electron diffraction. We observed well-resolved ZnO and GaN peaks in the high-resolution x-ray diffraction scans, with no Ga 2 ZnO 4 phase detectable. Low-temperature photoluminescence results indicate that high-quality GaN can be achieved on both O-and Zn-face ZnO.
Silicon carbide is a wide-band-gap semiconductor suitable for high-power high-voltage devices and it has excellent properties for use in photoconductive semiconductor switches ͑PCSSs͒. PCSS were fabricated as planar structures on high-resistivity 4H-SiC and tested at dc bias voltages up to 1000 V. The typical maximum photocurrent of the device at 1000 V was about 49.4 A. The average on-state resistance and the ratio of on-state to off-state currents were about 20 ⍀ and 3ϫ10 11 , respectively. Photoconductivity pulse widths for all applied voltages were 8-10 ns. These excellent results are due in part to the removal of the surface damage by high-temperature H 2 etching and surface preparation. Atomic force microscopy images revealed that very good surface morphology, atomic layer flatness, and large step width were achieved.
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