The intelligent transport system (ITS) has become one of the most globally researched topics with a lot of investment and development resources being dedicated into it due to its foreseen impact on the economic growth of the transport sector. Currently there are two main vehicle-to-everything (V2X) technologies, whose primary application is focused on ITS, backed up by the key players of various automotive, telecommunication and transport industries: dedicated short-range communications (DSRC) and cellular vehicle-to-everything (C-V2X), respectively based on IEEE 802.11p and 3GPP LTE/5G NR. While DSRC already has deployments, C-V2X is expected to see larger scale trails and deployments in 2020. In this work, the authors provide insight and review into two main V2X technologies, DSRC and C-V2X, their core parameters, shortcomings and limitations, and explore the need for integration of IoT-based technologies into modern ITS solutions. A comprehensive overview and analysis of currently commercially available V2X products, their sub-blocks and features is provided.

The structure of the modern wireless network evolves rapidly and maturing 4G networks pave the way to next generation 5G communication. A tendency of shifting from traditional high-power tower-mounted base stations towards heterogeneous elements can be spotted, which is mainly caused by the increase of annual wireless users and devices connected to the network. The radio frequency (RF) power amplifier (PA) performance directly affects the efficiency of any transmitter, therefore, the emerging 5G cellular network requires new PA architectures with improved efficiency without sacrificing linearity. A review of the most promising reported RF PA architectures is presented in this article, emphasizing advantages, disadvantages and concluding with a quantitative comparison. The main scope of reviewed papers are PAs implemented in scalable complementary metal–oxide–semiconductor (CMOS) and SiGe BiCMOS processes with output powers suitable for portable wireless devices under 32 dBm (1.5 W) in the low- and high- 5G network frequency ranges.

Development of 5G networks requires a substantial increase to both spectral and power efficiency of transmitters. It is known that these two parameters are subjected to a mutual trade-off. To increase the linearity without losing power efficiency, linearization techniques are applied to power amplifiers. This paper aims to compare most popular linearization techniques to date and evaluate their applicability to upcoming 5G networks. The history of each respective linearization technique is followed by the main principle of operation, revealing advantages and disadvantages supported by concluding the latest research results. Three main groups of linearization methods currently known are feedforward, feedback, and predistortion, each with its own tradeoffs. Although digital predistortion seems to be the go-to method currently, other techniques with less research attention are still non-obsolete. А generalized discussion and a direct comparison of techniques analyzed are presented at the end of this paper. The article offers a systematic view on PA linearization problems which should be useful to researchers of this field. It is concluded that there are still a lot of problems that need to be addressed in every linearization technique in order to achieve 5G specifications.

To process high-frequency signals on a printed circuit board (PCB), it is often necessary to carefully analyze and select the pad widths of the chip packages and components to match their impedance to the standard Z0. Modern PCBs are complex multilayer designs, utilizing either only high-end laminates, low-end laminates, or a combination of both. The on-board component footprints usually have larger pads that become discontinuities and corrupt the impedance of critical traces. One way to address this issue is to include reference plane cutouts as a measure of compensation. This paper aims to find out how an asymmetric dielectric stack-up affects the microstrip discontinuity impedance compensation using reference plane cutouts. The selected board layer stack-up imitates several different practical design scenarios, including costly PCBs that strictly comprise high-end dielectric materials, as well as trying to lower PCB cost by introducing low-cost materials without major performance sacrifice. S-parameter measurements are performed and confirmed by time domain reflectometry (TDR) measurements.

In this paper, four differently shaped Wilkinson power dividers are presented by selecting the same physical length of two-section transmission lines, dual arbitrary frequency band Wilkinson power dividers can be achieved. The 2.4 GHz (WLAN) and 5.9 GHz (DSRC IEEE 802.11p) frequency bands are selected to complement the future development of multi-band, multi-standard transceivers. To improve physical separation and electrical isolation between the two output ports a parallel RLC circuit is employed. For verification, the simulated and measured performance results of dual-band Wilkinson power dividers implemented on the Rogers 4003C laminate are presented. The measurement results for the fabricated Wilkinson power dividers were in good agreement with theoretical simulation results and show dual-band characteristics.