The process stability of Pb(Zr, Ti)O3 (PZT) sputtering was
studied by observing film composition change as a function of the
process duration ( e.g. integrating sputtering time). A useful
method of controlling compositional stability was developed. It
was found that the existence of a potentially grounded anode was
effective to prevent the large variation of Pb contents in PZT thin
films and improve the process stability of PZT sputtering.
(Pb, La)(Zr, Ti)O3 (PLZT) thin films were deposited on 6-inch Pt/Ti/SiO2/Si substrates by rf magnetron sputtering using a multichamber production system. The Pb content in PLZT films deposited at low temperature was measured by inductively coupled plasma (ICP) spectroscopy, and the structural properties of crystallized PLZT films were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). A novel method for Pb content control was developed and it was found that Pb content in PLZT film could be changed by changing the electric potential of the substrate. For ferroelectric properties, only small differences were observed between the rapid thermally annealed PLZT film and furnace- annealed ones. Good uniformities of film thickness, Pb content and remanent polarization were achieved on 6-inch wafers.
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