The rapid expansion of femtosecond (fs) laser technology brought previously unavailable capabilities to laser material processing. One of the areas which benefited the most due to these advances was the 3D processing of transparent dielectrics, namely glasses and crystals. This review is dedicated to overviewing the significant advances in the field. First, the underlying physical mechanism of material interaction with ultrashort pulses is discussed, highlighting how it can be exploited for volumetric, high-precision 3D processing. Next, three distinct transparent material modification types are introduced, fundamental differences between them are explained, possible applications are highlighted. It is shown that, due to the flexibility of fs pulse fabrication, an array of structures can be produced, starting with nanophotonic elements like integrated waveguides and photonic crystals, ending with a cm-scale microfluidic system with micro-precision integrated elements. Possible limitations to each processing regime as well as how these could be overcome are discussed. Further directions for the field development are highlighted, taking into account how it could synergize with other fs-laser-based manufacturing techniques.

In this work, we show how femtosecond (fs) laser-based selective glass etching (SLE) can be used to expand capabilities in fabricating 3D structures out of a single piece of glass. First, an investigation of the etching process is performed, taking into account various laser parameters and scanning strategies. These results provide critical insights into the optimization of the process allowing to increase manufacturing throughput. Afterward, various complex 3D glass structures such as microfluidic elements embedded inside the volume of glass or channel systems with integrated functional elements are produced. A single helix spring of 1 mm diameter is also made, showing the possibility to compress it by 50%. Finally, 3D structuring capabilities are used to produce an assembly-free movable ball-joint-based chain and magnet-actuated Geneva mechanism. Due to minimized friction caused by low (down to 200 nm RMS) surface roughness of SLE-produced structures, the Geneva mechanism was shown to be capable of rotating up to 2000 RPM.

Direct laser writing based on non-linear three-dimensional nanolithography (also known as 3D laser lithography, 3DLL) is a powerful technology to manufacture polymeric micro-optical components. However, practical applications of these elements are limited due to the lack of knowledge about their optical resilience and durability. In this Letter, we employ 3DLL for the fabrication of bulk (i.e., fully filled) and woodpile structures out of different photopolymers. We then characterize them using the S-on-1 laser-induced damage threshold (LIDT) measurements. In this way, quantitative data of LIDT values can be collected. Furthermore, this method permits to gather damage morphologies. The results presented demonstrate that LIDT values depend on the material and the geometry of the structure. Bulk non-photosensitized hybrid organic/inorganic photopolymer SZ2080 structures are found to be the most resilient with a damage threshold being 169 ± 15 m J / c m 2 .

Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 μm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.

Nowadays, lab-on-chip (LOC) devices are attracting more and more attention since they show vast prospects for various biomedical applications. Usually, an LOC is a small device that serves a single laboratory function. LOCs show massive potential for organ-on-chip (OOC) device manufacturing since they could allow for research on the avoidance of various diseases or the avoidance of drug testing on animals or humans. However, this technology is still under development. The dominant technique for the fabrication of such devices is molding, which is very attractive and efficient for mass production, but has many drawbacks for prototyping. This article suggests a femtosecond laser microprocessing technique for the prototyping of an OOC-type device—a liver-on-chip. We demonstrate the production of liver-on-chip devices out of glass by using femtosecond laser-based selective laser etching (SLE) and laser welding techniques. The fabricated device was tested with HepG2(GS) liver cancer cells. During the test, HepG2(GS) cells proliferated in the chip, thus showing the potential of the suggested technique for further OOC development.