2022
DOI: 10.3390/ma15082817
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Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant

Abstract: Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates… Show more

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Cited by 12 publications
(13 citation statements)
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“…As literature shows, rougher surfaces introduce significant flow resistance [ 29 ]. To avoid this, scientists are using SLE, which offers the capability to produce structures with surface roughness below 200 nm [ 30 ]. The surface quality criteria are one of the key disadvantages of femtosecond laser ablation.…”
Section: Results and Discussionmentioning
confidence: 99%
“…As literature shows, rougher surfaces introduce significant flow resistance [ 29 ]. To avoid this, scientists are using SLE, which offers the capability to produce structures with surface roughness below 200 nm [ 30 ]. The surface quality criteria are one of the key disadvantages of femtosecond laser ablation.…”
Section: Results and Discussionmentioning
confidence: 99%
“…Induced electron plasma waves inside the material interfere with incident radiation to produce interference patterns [ 45 , 50 ] that result in permanent periodic modifications. Subsequently, longer periods that result from higher wavelengths enable easier liquid penetration into the nanogratings due to the capillary forces and surface-wetting properties [ 27 ]. Etching rates that were only slightly lower than the maximum results were achieved by using 2nd harmonic 500 nJ pulse energy or 28.2 J/cm 2 energy density radiation.…”
Section: Resultsmentioning
confidence: 99%
“…Selectivity values above 1000 could be obtained for fused silica by laser parameter optimization [ 22 ]. Meanwhile, selectivity values above 2000 can be achieved by introducing a particular burst regime [ 26 ] or adding organic solvents to the etchant [ 27 ]. SLE is a perfect technology for high aspect ratio structure fabrication.…”
Section: Introductionmentioning
confidence: 99%
“…The etching protocols were optimized for the fastest etching procedure. This optimization has already been published elsewhere [ 36 ].…”
Section: Methodsmentioning
confidence: 99%