The use of substrate integrated waveguides (SIW) for microwave and millimeter wave integrated components has increased dramatically over the last decade. They mimic the performance of conventional metallic waveguides and they are fabricated using printed circuit boards using the top and bottom metallization with two rows of vias forming the side walls. This creates a low profile, compact, and light weight alternative to conventional metallic waveguides, and they allow a direct interconnection with printed circuit boards and active components. This article reviews the fundamental theory, documents the research that has been performed over the past decade, and summarizes progress up to the recent state-of-the-art including novel SIW structures for passive circuits and antennas as well as new applications for reconfigurable and printed circuits using SIW technology.
This paper demonstrates a new concept of multilayered patterned ground shield (PGS) for improving Q-factor of a Si-based spiral inductor. The impact of left-handed behavior of complementary split ring resonator (CSRR) and split ring resonator (SRR) patterns to realize a high inductance in the ground shield is explained through an equivalent circuit model. The proposed two layer patterned ground shield is shown to improve the Q-value of on-chip spiral inductors by 23.7%.
The complexity of RF front-end (RFFE) modules of wireless devices has increased dramatically over the past decade. In order to meet the demands for future mobile communications, RFFEs will need to enable multiband for global roaming, and multi-mode to support multiple cellular modes, incorporate beamforming antennas, and operate at mm-wave frequencies. To this end, this article presents a summary of the recent progress in RF substrate technologies, waveguide architectures and multi-band design techniques for 5G RFFE modules, and summarizes the present and future challenges in RFFE module design.
Abstract-In this paper, we propose a robust microwave characterization of inkjet printed components on flexible substrates, which aim at measuring the material properties of silver nanoparticle inks and the supporting dielectric spacer employed during measurements. Starting with propagation constant extracted from multiline thru-reflect-line calibration with coplanar waveguide (CPW) standards and then proceeding with finite element modeling of CPWs, the proposed technique can dynamically produce an interpolated search space by automatic driving of simulation tools. In the final stage, the algorithm utilizes a least-square optimization routine to minimize the deviation between model and measurements. Our technique significantly reduces the computing resources and is able to extract the material parameters using even a nominal ink profile. Characteristic impedances for CPWs are extracted using series resistor measurements from 10 MHz to 20 GHz. It is also shown that the proposed characterization methodology is able to detect any changes in material properties induced by changes in fabrication parameters such as sintering temperature. Ink conductivities of approximately 2.973 × 10 0.201 × 10 7 S/m respectively. We verified our technique by measuring the material parameters with conventional approach.
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