Nanostructured metal materials are the frontrunners of numerous electronic advancements. While realizing such potential, it is indispensable to address its oxidation and stability drawbacks, that are due to its high...
Flexible electronics for harsh and hazardous environments could offer a broad range of technological applications from conformal structural health monitoring, hypersonics, to telecommunication systems. However, advanced materials with the capability of additive manufacturing and the tolerance to extreme operating conditions are imperative. Here, we report hightemperature radiofrequency electronics with thermal management by printing copper hybrid conductors onto flexible thin alumina ribbon ceramic and ceramic fiber/silica aerogel composite. Regulating thermal stability, tuning resonance frequency, and increasing current-carrying ability of printed electronics are synergistically achieved using a flexible thermal-insulation ceramic fiber/silica aerogel composite or thermally conductive alumina ribbon ceramic substrates and high-temperature copper−graphene conductors. The printed copper conductor coatings exhibit tunable antenna resonance and electromagnetic interference effectiveness of 70 dB at a thickness of 5 μm, opening a pathway toward flexible hybrid radiofrequency electronics with thermal management.
As one of the conductive ink materials with high electric conductivity, elemental copper (Cu) based nanocrystals promise for printable electronics. Here, single crystalline Cu nanoplates were synthesized using a facile hydrothermal method. Size engineering of Cu nanoplates can be rationalized by using the LaMer model and the versatile Cu conductive ink materials are suitable for different printing technologies. The printed Cu traces show high electric conductivity of 6 MS/m, exhibiting electro-magnetic interference shielding efficiency value of 75 dB at an average thicknesses of 11 μm. Together with flexible alumina ceramic aerogel substrates, it kept 87% conductivity at the environmental temperature of 400 ℃, demonstrating the potential of Cu conductive ink for high-temperature printable electronics applications.
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