Hierarchical thermal-conductive polymer nanocomposites for thermal management

Li, Zheng; Tangudu, Jagadeesh; Saviers, Kimberly R.; Singh, Pratyush; Islam, Abdullah; Faghihi, Danial; Ren, Shenqiang

doi:10.1016/j.apmt.2023.101873

Cited by 2 publications

(2 citation statements)

References 36 publications

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“…Among the many methods, the template-based strategy is a new and effective method to realize the ordered and controllable assembly of low-dimensional nanometer packing. [80][81][82][83] By using 3D networked assembly techniques such as hot pressing, frozen formwork casting, and self-assembly, anisotropic high thermal conductivity can be achieved even in the case of low-concentration fillers. [84][85][86][87][88]…”

Section: Three-dimensional Thermal Network Strategymentioning

confidence: 99%

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

Wu,

Zhang,

Yan

et al. 2024

Journal of Polymer Science

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With the development of high power‐density electronic devices on smaller scales and emerging new energy vehicles, high thermal conductive materials have attracted more attention for better thermal management to adapt to various applications. By combining both the advantages of polymer materials and thermally conductive fillers, thermal conductive polymer composite materials are widely used in packaging and the protection of electronic devices for their mechanical robustness, high thermal conductivity, excellent insulation properties, heat resistance, and chemical resistance. In this review, first, the basic theory of heat conduction of polymer composites is discussed. Second, according to the classification of the composition of the thermal conductive polymer, the filled thermal conductive material is emphatically introduced. In this paper, the construction process of a thermal conductive network of polymer and composites is discussed from the perspective of processing. The simple construction of a thermal conductive network includes core‐shell structure, external force orientation, electrostatic spinning, electrostatic spraying, induced orientation, and vacuum‐assisted filtration. The three‐dimensional thermal conductivity network can be constructed using self‐assembly and template methods. From the above processing methods, this paper analyzes how to effectively improve thermal conductivity and achieve the goal of high thermal conductivity and excellent mechanical properties under low filling. After that, the contribution of filler and polymer modification to thermal conductivity is explained in detail. Finally, the future research direction of functionalization is prospected.

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Section: Three-dimensional Thermal Network Strategymentioning

confidence: 99%

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

Wu,

Zhang,

Yan

et al. 2024

Journal of Polymer Science

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show abstract

“…2. Thermal Properties: Enhanced thermal stability and reduced coefficient of thermal expansion are notable characteristics of these composites, attributed to the barrier effect and improved heat dissipation provided by the nano fillers [22].…”

Section: Thermoset Nano Filler Polymer Matrix Composite Materialsmentioning

confidence: 99%

Polymer Matrix Composites for Microelectronics Applications- A Review

2023

IRJMETS

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Polymer matrix composites (PMCs) have emerged as essential materials in the realm of microelectronics, offering unique properties and versatility crucial for various applications. This review encompasses the utilization of PMCs in microelectronics, focusing on the distinctions and applications of thermoset and thermoplastic-based composites. Exploring their inherent characteristics, manufacturing processes, and performance attributes, this comprehensive review delves into the diverse functionalities and structural implications of these materials within microelectronic devices. Assessing their thermal, mechanical, and electrical properties, the study highlights the significance of PMCs in providing solutions for miniaturization, thermal management, and structural integrity in microelectronic applications. Moreover, the discussion encompasses recent advancements, challenges, and future prospects in the domain, elucidating the evolving landscape and potential advancements for polymer matrix composites in the ever-expanding field of microelectronics.

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Hierarchical thermal-conductive polymer nanocomposites for thermal management

Cited by 2 publications

References 36 publications

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity

Polymer Matrix Composites for Microelectronics Applications- A Review

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