Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity

Abstract

Flexible electronics for harsh and hazardous environments could offer a broad range of technological applications from conformal structural health monitoring, hypersonics, to telecommunication systems. However, advanced materials with the capability of additive manufacturing and the tolerance to extreme operating conditions are imperative. Here, we report hightemperature radiofrequency electronics with thermal management by printing copper hybrid conductors onto flexible thin alumina ribbon ceramic and ceramic fiber/silica aerogel composite. Regulating thermal stability, tuning resonance frequency, and increasing current-carrying ability of printed electronics are synergistically achieved using a flexible thermal-insulation ceramic fiber/silica aerogel composite or thermally conductive alumina ribbon ceramic substrates and high-temperature copper−graphene conductors. The printed copper conductor coatings exhibit tunable antenna resonance and electromagnetic interference effectiveness of 70 dB at a thickness of 5 μm, opening a pathway toward flexible hybrid radiofrequency electronics with thermal management.

High‐Temperature Oxidation‐Resistant Printed Copper Conductors

“…The flexibility of the ceramic was established by bending tests with printed Cu‐G features in one of our previous works. [ 18 ] It is essential to note that the resistance values differ from sample to sample due to printing and sintering conditions, formation of the percolation network, and impurities that may be introduced between manufacturing and testing process. The sample thickness was measured and can be observed in Figure S4, Supporting Information.…”

Preparation of Ceramic Fiber Threads with Enhanced Abrasion Resistance Performance

“…Ceramic fiber thread is typically obtained by twisting continuous ceramic fiber bundles [14]. Owing to its good deformability and high-temperature resistance as a flexible ceramic fiber material [15][16][17][18][19], it has garnered significant attention in effectively connecting and securing high-temperature thermal protection and thermal sealing materials [20]. In the application process, ceramic fiber threads often need to undergo reciprocating friction movements within the processing equipment or in the internal structure of the materials they connect.…”

Synthesis of Citrate-Capped Sn Nanoparticles with Excellent Oxidation Resistance for High-Performance Electrically Conductive Adhesives

“…Metal nanoparticles are promising for manufacturing high-performance printable electronics for various applications. − Currently, metallic silver is the most widely used material, but cost-effective alternatives urgently need to be developed due to its relatively expensive cost. Tin (Sn) metal is a promising alternative to metallic silver due to its low cost, low melting point, and good chemical stability in bulk. − However, the route to obtain Sn nanoparticles and the electronic device based on them is still limited by the high intrinsic reactivity. − These nanoparticles are susceptible to re-oxidation in air, either after synthesis, during purification, or when the material is stored. − Therefore, developing tin nanoparticles with high antioxidation properties and excellent dispersibility is necessary to realize their potential fully.…”