Advanced materials, electrically conductive and oxidation resistant, are frontrunners for technological advancements in cutting‐edge high‐temperature electronics. Rational design and manufacturing of hierarchical material structures is indispensable to achieve such disparate functionalities. Here, high‐temperature copper–graphene conductors, through additive manufacturing, which prohibits oxygen adsorbates and serves as the barrier for oxygen migration to enable electric stability and reliability at high temperatures, are reported. The combination of graphene and alumina surface passivation enables the electric stability of copper–graphene under thermal impact above 1000 °C. The findings shown here, the synergistic combination of high conductivity and oxidation resistance, enunciate the passivation capabilities for additively manufactured flexible electronics operating under harsh conditions.
The increased power consumption and continued miniaturization of high-powered electronic components has presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channels width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kpa.
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