The evolution of the traditional metal oxide semiconductor field effect transistor (MOSFET) from planar single gate devices into 3D multiple gates has led to higher package density and high current drive. However, due to continuous scaling and as a consequent close proximity between source and drain in the nano-regime, these multigate devices have been found to suffer from performance degrading short channel effects (SCEs). In this paper, a three dimensional analytical model of a trigate MOSFET incorporating non-conventional structural techniques like silicon-on-insulator, gate and channel engineering in addition to gate oxide stack is presented. The electrostatic integrity and device capability of suppressing SCEs is investigated by deriving the potential distribution profile using the three dimensional Poisson’s equation along with suitable boundary conditions. The other device parameters like threshold voltage and subthreshold swing are produced from the surface potential model. The validity of the proposed structure is established by the close agreement among the results obtained from the analytical model and simulation results.

The semiconductor industry has implemented the technique of wrapping the gate electrode on different sides of channel to mitigate the degrading electrostatic effects in nanometer transistor. Intel adopted trigate architecture, wherein the channel is surrounded by gate electrode on three sides to improve the gate control over the channel. In order to further enhance the performance and diminish the short channel effects, triple material trigate silicon-oninsulator (SOI) MOSFET is explored in this work. An analytical model to determine the device electrostatics and match deviations due to device geometry has also been developed. The consequence of quantum confinement effects (QMEs), which arise due to ultra-thin body structure, on the inversion charge and threshold voltage has also been included. Thus, the analytical model presented in this work is based on a self-consistent solution of threedimensional Poisson's equation and two-dimensional Schrodinger equation with proper boundary conditions. The model is verified by the uniformity obtained between the results from analytical model and TCAD simulations. The superiority of the device has been demonstrated by comparing performance parameters like potential distribution, field variations, drain induced barrier lowering (DIBL) with already existing device structures like single material trigate (SMTG) and dual material trigate (DMTG) SOI MOSFETs

Here, the authors propose an analytical model to evaluate the performance of an advanced trigate MOSFET structure called trapezoidal trigate MOSFET on silicon-on-nothing (TTMSON). The model is based on the solution of Poisson's partial differential equation in three dimensions. The expression for potential distribution has been used to model other device parameters like electric field distribution, quantum inversion charge, and threshold voltage. The TTMSON device immunity to various short channel effects (SCEs), such as drain-induced barrier lowering (DIBL) and sub-threshold swing, has been examined. A detailed analysis of the gate and channel engineering techniques like dual material gate, graded channel, and dual material gate with graded channel has also been carried out to choose the best device structural configuration for enhancing the device performance and mitigating SCEs in nano-regime. In addition, the effect of inclination angle on different performance parameters has been considered. The proposed analytical model of TTMSON has been verified by comparing the model results with the simulation results using the numerical device simulator ATLAS.

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In this paper, a three dimensional (3-D) analytical model of surface potential has been derived for gate engineered trapezoidal trigate Tunnel Field Effect Transistor (TFET). The model has been obtained by assuming parabolic approximation of the potential profile and solving 3-D Poisson equation using appropriate boundary conditions. The device considered in this work is silicon based TFET with gate composed of two materials with different work functions. The low work-function material is placed close to source and drain region while high work-function material is placed in between them. This will result in enhancing the tunneling in the source/channel interface region while reducing the electric field in the drain region. Trigate devices have been found to enhance the device performance at nanoscale, however, Trigate device fabricated by Intel have been found to have trapezoidal shape rather than expected rectangular shape. In this work, we have included the effect of different inclination angles of sides on the device performance. The model has been verified by comparing the results with the simulation results obtained in ATLAS software.