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Short-duration high-intensity pulsed electron beams have been used to anneal ionimplantation damage in silicon and to electrically activate the dopant species. Lattice regrowth and dopant activation were determined using 4He+ backscattering, SEM, TEM, and device performance characteristics as diagnostic techniques. The annealing mechanism is believed to be liquid-phase epitaxial regrowth initiating from the substrate. The high-temperature transient pulse produced by the electron beam causes the dopant to diffuse rapidly in the region where the liquid state is achieved.