No abstract

The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presence or absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVD vs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.

Plastic deformation in thin copper films has been studied at room temperature. Copper films having a thickness of 1 μm were made by sputtering onto nickel substrates with a Si3N4 underlayer and with or without a Si3N4 caplayer. Deformation experiments were conducted using a special micro-tensile tester built into a θ–θ diffractometer. The problems normally associated with tension tests of free-standing films were avoided by deforming the substrate and film together. In-situ x-ray measurements of the lattice spacings and lattice spacing distributions were used to determine both elastic and plastic strains. The effects of caplayer and annealing temperature on mechanical properties are reported.

No abstract