Yield and Electrical Functionality of the Glass-Laminated Conductive Wires and Connectors

Abstract

Large area electronics is becoming an embedded part of structural elements such as automotive and architectural glasses. In this study, the effect of glass lamination based fabrication process on the electrical performance and production throughput yield (TPY) of printed conductive wires and surface mounted (SMD) connectors on polyethylene terephthalate (PET) carrier film were investigated by measuring their electrical conductivity after lamination. Based on the experiments, lamination decreases the production yield of conductive wires and connectors due broken wires or dislocated connectors, especially if they are located close to the corners of laminate. On the other hand, lamination was observed to improve the electrical conductivity of wires. In addition, some potential failure mechanisms are discussed.

Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application

“…Reducing the thickness of heatsinks would reduce the overall length of the complete stack, which helps increase safety, especially in working conditions with vibrations or bumps. Moreover, as an electrical interface of the stack, according to the calculation formula of metal conductivity (7) [31], the heatsink thickness Hh is inversely proportional to the electrical conductivity Λele:…”

Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics

“…Smart glass laminates consisting of electronical functionalities embedded within the structure [6], [7], are practical examples of hybrid structural electronics (HSE) products exploited in architectural industry as enhancing, This work is financially supported by Business Finland funded project (Dnro 3944/31/2014), Academy of Finland's FIRI funding (grant no. 320017) and European Regional Development Fund's Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications (grant no.…”

“…Some structural differences also exist when utilizing additive manufacturing methods, creating variations within sample populations, and affecting on the characteristics of HE or SE devices. [7] Light-emitting devices (LEDs) based on conventional semiconductors, typically silicon, are often used as a light source in optoelectronics based smart surfaces. LEDs are favorable for structural hybrid electronics due to their great light emitting properties, low power requirements, small size, and long lifetime [14], [15].…”

“…In the case of SE, the LEDs undergo considerably high temperature cycles during the manufacturing process [7,6]. In addition, their operational conditions and interfaces inside the SE element are unconventional.…”

“…The cooling effect of the SE device structure is not well known, nor are there knowledge or specific design rules to achieve sufficient temperature control. [7] Since the optimization of those properties, based on iterative experimental development is resource demanding, a quicker and more inexpensive modelling-based design is required.…”