Wide temperature range 0 &lt; T &lt; 85 °C narrow linewidth discrete mode laser diodes for coherent communications applications

O’Carroll, John; Phelan, Richard; Kelly, Brian; Byrne, Diarmuid; Barry, Liam P.; O’Gorman, J.

doi:10.1364/oe.19.000b90

Cited by 35 publications

(18 citation statements)

References 13 publications

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“…The first two (Fig. 4 (a) and (b)) front-end configurations are traditional homodyne (using original transmitter CW laser as LO) and DSP-assisted intradyne (using free-running 200-kHz linewidth discrete mode semiconductor laser (DML) [23] with polarization maintaining (PM) fiber pigtail) setups. The third receiver front-end, Fig.…”

Section: Methodsmentioning

confidence: 99%

“…4 (d) represents our receiver without the electronic PLL and was used to study the influence of the guardband width on system performance [18]. Here, 5% of the data signal is tapped off and used in our carrier recovery module, which consisted of a polarization controller (PC), variable optical attenuator (VOA), a polarization-maintaining optical circulator, and an isolator-free DML [23] that serves as the receiver LO. The principal difference between Fig.…”

Section: Methodsmentioning

confidence: 99%

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Homodyne OFDM with Optical Injection Locking for Carrier Recovery

Liu

Kim

et al. 2015

J. Lightwave Technol.

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Abstract-Homodyne detection provides the simplest digital signal processing (DSP) solution to optical coherent detection and minimizes the receiver bandwidth requirements. These features make it promising for high spectrally-efficient formats such as Optical Orthogonal Frequency Domain Multiplexing (OFDM), which has a flat optical spectrum and which is thus inherently sensitive to high frequency distortions, e.g., due to limited detector bandwidth. The key to homodyne detection is recovery of the carrier from the received signal all optically (as opposed to frequency offset compensation via digital signal processing. Herein we use optical injection locking (OIL) in conjunction with carrier tone-assisted OFDM to achieve this. In contrast to previous reports, we show that OIL carrier recovery with subsequent homodyne detection can operate without the need for any optical pre-filtering. First, we evaluate the performance as a function of the carrier tone guardband bandwidth. Further, we improve the robustness of this technique using a slow phase lock loop that compensates for drift in the laser's temperature/current control electronics. Using this improved setup, we compare our all-optical-carrier-recovered homodyne and the 'traditional' DSP-assisted intradyne detection for the case of OFDM-16QAM signals. Finally, we compare the computing complexity necessary for both approaches and estimate the intradyne performance limitations due to the carrier-local oscillator frequency offset.Index Terms-Optical fiber communication, homodyne detetion, OFDM, optical injection locking.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Homodyne OFDM with Optical Injection Locking for Carrier Recovery

Liu

Kim

et al. 2015

J. Lightwave Technol.

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“…The output power of the PFL was 3 dBm. The other laser was a 1548-nm DML [18,19]. The key advantage of this laser is its low fabrication cost (the fabrication process is simpler than for the widely used DFB lasers).…”

Section: Methodsmentioning

confidence: 99%

“…In Section II we discuss our experimental setup. To evaluate limitations due to the modulation chirp and optical noise, we compare the results obtained with a LiNbO3 Mach-Zehnder modulator (MZM) with two monolithic (and thus potentially low-cost) directlymodulated lasers: a passive feedback laser (PFL) [17] (modulation bandwidth of 34 GHz), and a discrete mode laser (DML) [18,19] (modulation bandwidth of 8.6 GHz). We test them in repeater-less transmission experiments through up to 150 km of SMF-28.…”

Section: Introductionmentioning

confidence: 99%

Discrete Multitone Format for Repeater-Less Direct-Modulation Direct-Detection Over 150 km

Liu

Kelly

O’Carroll

et al. 2016

J. Lightwave Technol.

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-High-capacity and low-cost repeater-less transmission beyond 50 km is of interest for the next-generation inter-data center communications. Transmission over such relatively long distance generally requires transmission in the 1550-nm low-loss telecom band that is, however, impaired by chromatic dispersion. Here, we study the performance of the direct modulation direct detection (DM-DD) system using the discrete multi-tone (DMT) format for repeater-less transmission through up to 150 km of a standard single mode fiber (SMF-28) using the 1550-nm band. The achievable capacity for two different types of directly modulated lasers is studied experimentally and compared with that achievable using chirp-free modulation using a push-pull LiNbO3 Mach-Zehnder external modulator (MZM). The benefit of using a larger bandwidth signal is found to diminish as the transmission distance increases. 28 and 25 Gbit/s signal transmission (Bit Error Ratio, BER < 3.8×10 -3 ) over 50 km and 75 km are achieved using just 8-GHz modulation-bandwidth.

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“…Without adequate thermal-sinking, the laser-chip on the MOB is likely to overheat, leading to reduced performance or burning-out. Good thermal contact between the MOB and the PIC, as well as thermo-electric cooler (TEC), are needed for stable operation of the MOB [42]. thermal-sinking, the laser-chip on the MOB is likely to overheat, leading to reduced performance or burning-out.…”

Section: Micro-optical Benchmentioning

confidence: 99%

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

et al. 2016

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Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.

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Wide temperature range 0 < T < 85 °C narrow linewidth discrete mode laser diodes for coherent communications applications

Cited by 35 publications

References 13 publications

Homodyne OFDM with Optical Injection Locking for Carrier Recovery

Homodyne OFDM with Optical Injection Locking for Carrier Recovery

Discrete Multitone Format for Repeater-Less Direct-Modulation Direct-Detection Over 150 km

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

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