2001
DOI: 10.1106/152451102024669
|View full text |Cite
|
Sign up to set email alerts
|

Wide Bandgap Materials in Thermal Management of Electronic Structures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
6
0

Year Published

2007
2007
2007
2007

Publication Types

Select...
1
1

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(6 citation statements)
references
References 0 publications
0
6
0
Order By: Relevance
“…Paste mixtures have included three different c-BN/frit percentages: 95% c-BN, 5% glass; 90% c-BN, 10% glass; and 85% c-BN, 15% glass. The organic vehicle is used in amount 15-25% per weight in respect to all pastes [3,4].…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Paste mixtures have included three different c-BN/frit percentages: 95% c-BN, 5% glass; 90% c-BN, 10% glass; and 85% c-BN, 15% glass. The organic vehicle is used in amount 15-25% per weight in respect to all pastes [3,4].…”
Section: Methodsmentioning
confidence: 99%
“…It is also a good insulator [1,2]. Main disadvantage of this material with respect to its preparing in a form of a thick film is the fact that it is refractory, highly abrasive and difficult to wet by the inorganic binder.…”
Section: Introductionmentioning
confidence: 99%
“…Our evaluation of novel c-BN-glass thick films as heat conductors have showed positive results [8,9]. The evidence for the efficacy of the present c-BN thick films as thermal management systems, is presented in Fig.…”
Section: Rapid Heat Transfer and Heat Sinking Surfacesmentioning
confidence: 93%
“…The referenced thick films [7][8][9] when printed with top and bottom electrodes (Pd/Ag and/or Au), have shown I-V characteristics that suggest applicability as …”
Section: High Dielectric Constant Structures As (Super) Capacitors Anmentioning
confidence: 99%
See 1 more Smart Citation