2010
DOI: 10.1021/la100783w
|View full text |Cite
|
Sign up to set email alerts
|

Wet Chemical Functionalization of III−V Semiconductor Surfaces: Alkylation of Gallium Phosphide Using a Grignard Reaction Sequence

Abstract: Single-crystalline gallium phosphide (GaP) surfaces have been functionalized with alkyl groups via a sequential Cl-activation, Grignard reaction process. X-ray photoelectron (XP) spectra of freshly etched GaP(111)A surfaces demonstrated reproducible signals for surficial Cl after treatment with PCl(5) in chlorobenzene. The measured Cl content consistently corresponded to approximately a monolayer of coverage on GaP(111)A. In contrast, GaP(111)B surfaces treated with the same PCl(5) solution under the same cond… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

6
60
1

Year Published

2012
2012
2022
2022

Publication Types

Select...
7
1
1

Relationship

1
8

Authors

Journals

citations
Cited by 38 publications
(67 citation statements)
references
References 56 publications
6
60
1
Order By: Relevance
“…Before the GaP wafers were exposed to the azide reactants, the cleaned GaP wafers were subject to water contact angle in order to identify that the wafers were indeed clean and ready for functionalization. A clean GaP surface revealed a water contact angle of about 16°, which is consistent with previous reports (Flores‐Perez et al ., ; Mukherjee et al ., ). After functionalization with AAP and 4AB, the contact angle increased to about 33 ± 5° and 53 ± 5°, respectively (Table ).…”
Section: Resultsmentioning
confidence: 97%
“…Before the GaP wafers were exposed to the azide reactants, the cleaned GaP wafers were subject to water contact angle in order to identify that the wafers were indeed clean and ready for functionalization. A clean GaP surface revealed a water contact angle of about 16°, which is consistent with previous reports (Flores‐Perez et al ., ; Mukherjee et al ., ). After functionalization with AAP and 4AB, the contact angle increased to about 33 ± 5° and 53 ± 5°, respectively (Table ).…”
Section: Resultsmentioning
confidence: 97%
“…(32) n-GaP samples were prepared from n-GaP wafers that had a sulfur dopant density of ~ 5 × 10 17 cm -3 . Small (~ 0.3 cm 2 ) pieces were cut from the wafer using a scribe, and the pieces were then etched in 18.…”
Section: Preparation Of Si Gaas and Gap Substratesmentioning
confidence: 99%
“…In this context, the lack of order mirrors that seen for GaP(111)A surfaces modified with straight alkyl chains through reaction with Grignard reagents. 21,33 However, at the same nominal surface coverages, the surface layers produced here appeared to be less effective at eliminating further oxidation of the underlying GaP substrate. 21 This discrepancy suggests a difference in the stability of the surface bond occurring at GaP(111)B surfaces modified by the Williamson ether approach or GaP(111)A surfaces modified by Grignard reagents (i.e., P−O−C vs Ga−C, respectively).…”
Section: P Oh Po Hmentioning
confidence: 84%