2020
DOI: 10.1016/j.optmat.2020.109990
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Wafer-scale 4H-silicon carbide-on-insulator (4H–SiCOI) platform for nonlinear integrated optical devices

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Cited by 53 publications
(40 citation statements)
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“…4H-SiCOI Microring Resonator Fabrication: The 4H-SiCOI chip was fabricated through the ion-cut process. [47] The waveguide fabrication started from the 4H-SiCOI chip with 500 nm SiC top layer and 2:1 μm buried oxide layer. The positive resist AR-P 6200.09 was spun on the chip with a thickness of 210 nm.…”
Section: Methodsmentioning
confidence: 99%
“…4H-SiCOI Microring Resonator Fabrication: The 4H-SiCOI chip was fabricated through the ion-cut process. [47] The waveguide fabrication started from the 4H-SiCOI chip with 500 nm SiC top layer and 2:1 μm buried oxide layer. The positive resist AR-P 6200.09 was spun on the chip with a thickness of 210 nm.…”
Section: Methodsmentioning
confidence: 99%
“…The 4H-SiCOI chip is fabricated by the Smart-cut process [4]. The microring resonator is defined by electronbeam lithography with the positive resist AR-P 6200, coated on the 4H-SiCOI chip.…”
Section: Dual-pump Optical Parametric Oscillation In a 4h-sic-on-insu...mentioning
confidence: 99%
“…SiC photonics has been developed for over a decade [19][20][21][22][23][24][25] , one of the major obstacles for the practical application is the difficulty of fabricating ultralow optical loss SiC thin films on the wafer-scale. 4H-silicon-carbide-on-insulator (4H-SiCOI) formed by ion-cutting technique has been optimized 26 . Although it has a wafer-level size, the material absorption generated by the ion-implantation-induced defects was considered as the main loss source 24 and the Q factor is limited to below 10 5 .…”
Section: Introductionmentioning
confidence: 99%