Voltage–current characteristics of a high-power pulsed sputtering (HPPS) glow discharge and plasma density estimation

The temporal evolutions of target voltage and current waveforms under different pulse voltage and working pressure conditions were studied during Cr high power impulse magnetron sputtering discharges. Target voltage and current characteristics demonstrated that when the pulse width was set as 200 ls, HiPIMS discharge went through a four-stage sequence during each pulse, Townsend discharge, glow discharge, afterglow, and pulse-off stages. A discharge state transition in the glow discharge stage happened at high pulse voltage and working pressure conditions. Furthermore, the dependence of reduced cathode fall thickness pd c on pulse voltage, working pressure, and normalized current density j/p 2 was presented. It was found that gas rarefaction leads to a change of relationship between pd c and j/p 2. A noticeable increase of the cathode fall thickness caused by gas rarefaction has been found.

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“…The peak ion density is estimated using the current density at the target as the cathode by using the following equation: 22,23…”

Section: Peak Ion Densities With the Variation Of Pulse Voltage Anmentioning

confidence: 99%

Discharge state transition and cathode fall thickness evolution during chromium HiPIMS discharge

Zuo

Chen

et al. 2017

Physics of Plasmas

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“…The underlying mechanisms of operation are generally understood, although many features still lack a detailed description.André Anders et al [19,20] studied The voltage current time relationship of high power pulsed magnetron sputtering, they use different target materials studying the effect of pressure to discharge characteristics,such as Cu, Ti, Nb, C, W, Al and Cr target. It was argued that the emission of secondary electrons is the key mechanism for supplying energy.And the next step will use the computer simulation method to understand the discharge characteristics of plasma [19].Ken Yukimura et al [21,23] designed high power pulsed magnetron sputtering power source,plasma discharge was simulated as a parallel sphere model of equivalent circuit of resistance and capacitance, and they used the model to estimate ion density in the range of 10 16 -10 17 m -3 . In order to better understand discharge characteristics of HiPIMS plasma,Scott Kirkpatrick [24] considered about the discharge process of collision effect and the sheath characteristics, and established the plasma equivalent circuit model with oscillation, the result shows that the oscillating voltage not rule is likely to cause large current in whole discharge process ,the oscillation amplitude was increased with frequency of the plasma.…”

Section: Thin Films Prepared By Hipimsmentioning

confidence: 99%

New Plasma Surface Processing Technology and its Application

Cao

Chen

2014

AMM

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Plasma surface processing technology can improve the mechanical properties, the corrosion resistance and chemical properties of the parts; therefore it has been widely used in industrial field. Advanced plasma surface processing technology is also constantly innovation, high power pulsed magnetron sputtering technique has been studied and explored by many scholars in recent years, and also gradually began to be used in the industry . This paper mainly introduces the study of HiPIMS dynamic and application over the past ten years. The HiPIMS discharge mechanism research method and theory is summarized .And the influence of the preparation process parameters about voltage, pressure, pulse width and frequency to compound film performance is systematically described, a detection method for thin film by HiPIMS is also introduced. These will provide guidance for the preparation of reactive HiPIMS.

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Glows, arcs, ohmic discharges: An electrode-centered review on discharge modes and the transitions between them

Anders

2024

Applied Physics Reviews

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Ever since they have been studied, gas discharges have been classified by their visual appearance as well as by their current and voltage levels. Glow and arc discharges are the most prominent and well-known modes of discharges involving electrodes. In a first approximation, they are distinguished by their current and voltage levels, and current–voltage characteristics are a common way to display their relations. In this review, glow discharges are defined by their individual electron emission mechanism such as secondary electron emission by photons and primary ions, and arcs by their respective collective mechanism such as thermionic or explosive electron emission. Emitted electrons are accelerated in the cathode sheath and play an important role in sustaining the discharge plasma. In some cases, however, electron emission is not important for sustaining the plasma, and consequently we have neither a glow nor an arc discharge but a third type of discharge, the ohmic discharge. In part 1 of this review, these relationships are explained for quasi-stationary discharges, culminating with updated graphical presentations of I–V characteristics (Figs. 15 and 16). In part 2, further examples are reviewed to include time-dependent discharges, discharges with electron trapping (hollow cathode, E×B discharges) and active anode effects.

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Voltage–current characteristics of a high-power pulsed sputtering (HPPS) glow discharge and plasma density estimation

Cited by 5 publications

References 10 publications

Discharge state transition and cathode fall thickness evolution during chromium HiPIMS discharge

Discharge state transition and cathode fall thickness evolution during chromium HiPIMS discharge

New Plasma Surface Processing Technology and its Application

Glows, arcs, ohmic discharges: An electrode-centered review on discharge modes and the transitions between them

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