2009
DOI: 10.1016/j.microrel.2009.03.022
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Vibration reliability test and finite element analysis for flip chip solder joints

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Cited by 82 publications
(30 citation statements)
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“…5 shows the measured accelerations by the accelerometers during the qualification level to the z direction with the edge clamped condition, representing that the data from the accelerometer on the aluminum block (base) satisfied the input PSD profile, and the peak due to the first resonance frequency of the specimen (PCB) was found at about 200 Hz, reaching 200 g 2 /Hz. The data signifies that the failures, if any, would be occurred at the first vibration mode, as was discussed in the previous works [8,9,14]. Another prominent peak was found at about 1010 Hz.…”
Section: Testssupporting
confidence: 77%
See 1 more Smart Citation
“…5 shows the measured accelerations by the accelerometers during the qualification level to the z direction with the edge clamped condition, representing that the data from the accelerometer on the aluminum block (base) satisfied the input PSD profile, and the peak due to the first resonance frequency of the specimen (PCB) was found at about 200 Hz, reaching 200 g 2 /Hz. The data signifies that the failures, if any, would be occurred at the first vibration mode, as was discussed in the previous works [8,9,14]. Another prominent peak was found at about 1010 Hz.…”
Section: Testssupporting
confidence: 77%
“…Up to date, without particular referring to the space application, the literatures represented the mechanical reliability under the vibrations of either sinusoidal or random types. For example, Che and Pang [8] conducted the constant G-level and varying G-level sinusoidal vibration tests for FCOB assembly, and the maximum G level was 10. Dasgupta et al [9] used a sinusoidal vibrations increasing from 0.1 g 2 /Hz to 0.4 g 2 /Hz for the durability tests.…”
Section: Introductionmentioning
confidence: 99%
“…The stresses of the critical solder joints were fed into a fatigue damage model to predict the life. Che and Pang [7] investigated the stress strain behavior of flip chip solder joint by developing a quasi-static model and used Miner's cumulative damage law to assess the fatigue life.…”
Section: Introductionmentioning
confidence: 99%
“…Chen et al [1] combined the vibration failure test, FEA, and theoretical formulation for the calculation of the electronic component's fatigue life under sinusoidal vibration loading. Che et al [2] employed vibration fatigue test and analysis methodology for flip chip solder joint fatigue life assessment. Perkins and Sitaraman [3] used linear sweep vibration test to characterize the fatigue failure for ceramic column grid array (CCGA).…”
Section: Introductionmentioning
confidence: 99%