PBGA packaging reliability assessments under random vibrations for space applications

Kim, Yeong K.; Hwang, Do Soon

doi:10.1016/j.microrel.2014.09.022

Cited by 34 publications

(9 citation statements)

References 19 publications

(26 reference statements)

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“…1) for the four types of adhesive. The differences in the fracture loads were statically insignificant (t-test, 95% confidence) even though the crack path for the underfills was within the PCB (PC failure mode), while for the edge-bonds it was at the interface between the solder mask and layer 2 1 For interpretation of color in Fig. 16, the reader is referred to the web version of this article.…”

Section: Fracture Of Specimens With Concave Filletsmentioning

confidence: 99%

“…Adhesives can be used as underfills [1][2][3][4] where a low-viscosity adhesive completely fills the gap between the component and the PCB, and edge-bonding [5][6][7] where only the perimeter of the component is bonded to the PCB using a more viscous adhesive. In underfilling, which is the more conventional approach, dots of a low-viscosity adhesive are dispensed on the printed circuit board near the periphery of the component where they flow through capillary action between the solder balls before being thermally cured [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Akbari

Nourani

Spelt

2016

Composites Part A: Applied Science and Manufacturing

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Section: Fracture Of Specimens With Concave Filletsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Akbari

Nourani

Spelt

2016

Composites Part A: Applied Science and Manufacturing

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“…Che and Pang [10] studied the failure behavior of QFP solder joints under vibration stress, using a high-speed camera to capture the dynamic displacement of the PCB board encapsulating the QFP chip, and regarding the displacement change as a state monitoring signal to study the characterization of solder joint failure and failure modes. Kim and Hwang [11] studied the reliability of PBGA solder joints under random vibration load. In the vibration test, the chip was encapsulated on a daisy chain circuit board to collect the solder joint electrical signals, and the solder joint resistance signal was regarded as the damage state evaluation index.…”

Section: Introductionmentioning

confidence: 99%

Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

et al. 2021

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Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of vibration environment stress. In regard to the failure characterization and degradation modeling of electronic packaging solder joints under vibration load, this paper adopts environmental stress tests, builds a vibration failure test platform, designs a vibration load excitation spectrum, and obtains solder joint degradation data under vibration stress; it uses the square root amplitude, form factors, and kurtosis factors to characterize the solder joint degradation process, which effectively identify the solder joint degradation node, and improve the data monotonicity of the solder joint degradation process; the Wiener process is used to build a solder joint multi-stage degradation model. Based on the EM algorithm, the hyperparameters of the degradation model have been optimized, and the universal test of the Wiener degradation model with multiple samples is carried out in accordance with the LB index. The analysis shows that the effectiveness of different samples is as high as 87.5%, which verifies the universality of the Wiener degradation model; Based on the crack morphology subject to the solder joint test and the features of the solder joint in the multi-stages, the paper analyzes the crack propagation behavior of the solder joint, and clarifies the failure mechanism of the solder joint.

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“…Several previous studies have focused on securing the mechanical safety of a solder joint under vibration excitation by applying mitigation techniques to the package, such as applying an underfill or dummy solder balls [6][7][8]. Kim and Hwang [6] investigated the effect of underfill on the fatigue life of a plastic ball grid array (PBGA) package for space usage under random vibration excitation of the launch.…”

Section: Introductionmentioning

confidence: 99%

Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

Park

Jeon

Kim

et al. 2018

International Journal of Aerospace Engineering

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Thermal gap pads are widely used for effective heat transfer from high-heat-dissipating components to a heat sink. The initial contact pressure of thermal pads is an important parameter for enhancing the heat transfer capability of thermal design during the assembly process of the heat sink. However, this causes stress on the solder joint of the component as a result of the pad’s inherent resistance to deformation. In this study, we investigated the effect of thermal pad on the fatigue life of the solder joint of CCGA 624 package for space usage. A random vibration fatigue test for several specimen assembly sets with various pressurization levels of thermal gap pads was performed, and their fatigue lives were compared with that of the package without the initial pressure of thermal gap pads.

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PBGA packaging reliability assessments under random vibrations for space applications

Cited by 34 publications

References 19 publications

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

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