High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Yu, Dingwen; Al-Yafawi, Abdullah; Nguyen, Tung; Park, Seungbae; Chung, Soonwan

doi:10.1016/j.microrel.2010.10.003

Cited by 120 publications

(35 citation statements)

References 15 publications

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“…The complexity of these models depends on if the internal stresses of components are required. Yu et al related the fatigue parameters obtained with harmonic excitation to the fatigue life of ball grid array (BGA) solder joints under the random excitation [1]. Li considered a detailed modeling approach for random vibration analysis and fatigue prediction of electronic components [2].…”

Section: Introductionmentioning

confidence: 99%

Fatigue Life Prediction for PBGA under Random Vibration Using Updated Finite Element Models

Fei

Jiang

et al. 2016

Exp Tech

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A procedure based on finite element (FE) modeling, response surface-based model updating and random vibration analysis is presented to predict the fatigue life of plastic ball grid array (PBGA) components mounted on daisy chain printed circuit board (PCB). A specially designed fixture is used to mimic the typical boundary condition of plug-in PCBs. The FE model is updated through three consecutive stages. In each stage, the first three resonant frequencies are calculated using ANSYS and correlated with modal test results. Two objective functions are created using resonant frequencies and minimized using a multi-objective genetic algorithm (MOGA). The results show that commercial FE software can be used to improve the accuracy of the FE model in a practical way. Random vibration analysis is performed and good agreement with test result is obtained. The resistance of the specially designed daisy chain PCB is monitored. A two-parameter Weibull distribution is used to fit the PBGA failure time. The Von Mises stress power spectral density (PSD) of the critical solder joints is calculated in ANSYS and transferred into time-history data. The rainflow cycle counting (RFCC), the S-N curve and the Miner's rule are used to estimate the cumulative damage. The calculated fatigue life agrees well with the test results.

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Section: Introductionmentioning

confidence: 99%

Fatigue Life Prediction for PBGA under Random Vibration Using Updated Finite Element Models

Fei

Jiang

et al. 2016

Exp Tech

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“…Han et al [14] performed the vibration fatigue analysis of a spot-welded structure with an iterative approach. Research studies relating the fatigue parameters obtained with harmonic excitation to the fatigue life under the random base-excitation were presented by Chen et al [15] and Yu et al [16], where the ball grid array (BGA) solder joints were the subject of analysis. In this study, the second part is focused on the estimation and experimental validation of the fatigue life prediction of a linear Y-shaped structure under a random vibration loading, where the fatigue parameters obtained with the harmonic fatigue tests are used.…”

Section: Introductionmentioning

confidence: 99%

Vibrational Fatigue and Structural Dynamics for Harmonic and Random Loads

Česnik

Slavič

2015

SV-JME

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“…The properties were obtained preferably in the reference paper (Liguore and Followell (1995) / YU et al (2011) / Genç (2006). Otherwise the data was taken from components datasheet or from Steinberg (2000).…”

Section: Appendix C: Summary Of Pcb and Ec Propertiesmentioning

confidence: 99%

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Braz

Bussamra

2017

Lat. Am. j. solids struct.

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Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

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High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Cited by 120 publications

References 15 publications

Fatigue Life Prediction for PBGA under Random Vibration Using Updated Finite Element Models

Fatigue Life Prediction for PBGA under Random Vibration Using Updated Finite Element Models

Vibrational Fatigue and Structural Dynamics for Harmonic and Random Loads

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

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