Variable RF Inductor on Si CMOS Chip

Sugawara, Hirotaka; Yokoyama, Yoshihiro; Gomi, S.; Ito, Hiroyuki; Okada, Kei; Hoshino, H.; Onodera, Hidetoshi; Masu, Kazuya

doi:10.1143/jjap.43.2293

Cited by 25 publications

(12 citation statements)

References 3 publications

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“…However, they have large series resistance caused by the onresistance in transistor channel, so it is difficult to achieve highquality RF circuit. Recently, the variable capacitor and inductor using MEMS technology are proposed [8,9,10,11,12], which practically achieve wide-range and high-quality characteristics. They have high potential for the reconfigurable RF circuit design, while the manufacturing cost is not low at present time.…”

Section: V P Cmentioning

confidence: 99%

“…Here, the variable MEMS inductors are explained [9,10,11,12]. The variable inductor consists of a conventional planar spiral inductor, a metal plate and a MEMS actuator.…”

Section: V P Cmentioning

confidence: 99%

“…Two types of MEMS actuator can be used. One uses horizontal movement [9,10,11], which is realized by a comb-type MEMS actuator [13]. The other uses vertical movement of metal plate [12], which is realized by a parallel-plate actuator [14].…”

Section: V P Cmentioning

confidence: 99%

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A dynamic reconfigurable RF circuit architecture

Okada

Yoshihara

Sugawara

et al. 2005

Proceedings of the 2005 Conference on Asia South Pacific Design Automation - ASP-DAC '05

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This paper proposes a dynamic reconfigurable architecture for analog RF circuits. The architecture consists of RF circuits and a control circuit. The RF circuits can be reconfigured by bias voltages of transistors and variable passive components, and the RF circuit block can also be switched dynamically. The proposed architecture can realize the multi-band/mode RF circuit in single chip for the Software Defined Radio, which achieves considerable reduction of circuit area and power consumption. On the other hand, we can obtain robust RF circuits by the dynamic reconfiguration for the process variation, the dynamic change of temperature, etc. I. IDigital circuits can achieve high performance according to the miniaturization of process technology. However, analog RF circuit design becomes difficult because of low supply voltage, design margin for device variations and operating temperature, etc. On the other hand, recent analog RF circuit requires more integration and multi-band/mode function by the development of radio communication technology [1, 2]. While single chip circuit can achieve high performance, miniaturization and low cost, the analog circuit design becomes more difficult. Furthermore, RF circuit performance is degraded by process variation, temperature at the runtime, simulation error, etc, which also contributes to make the RF circuit design difficult. It is an indispensable technology to reduce the design cost of RF circuits.For such a complicated analog RF circuit design, we propose reconfigurable RF circuit architecture [3]. The architecture can improve yield and design manufacturability of RF circuits by the corroboration of analog and digital circuits. The circuit performance can be dynamically controlled at the runtime by operating the bias voltages of transistors, variable devices and reconfigurable switches. For example, Fig.

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Section: V P Cmentioning

confidence: 99%

“…Here, the variable MEMS inductors are explained [9,10,11,12]. The variable inductor consists of a conventional planar spiral inductor, a metal plate and a MEMS actuator.…”

Section: V P Cmentioning

confidence: 99%

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A dynamic reconfigurable RF circuit architecture

Okada

Yoshihara

Sugawara

et al. 2005

Proceedings of the 2005 Conference on Asia South Pacific Design Automation - ASP-DAC '05

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“…8 The variable inductor embedded in a Si CMOS chip is achieved by moving a metal plate above the inductor. 9 However, the integration of the inductor and the positioning apparatus of metal-plate shielding is a critical concern.…”

Section: Introductionmentioning

confidence: 99%

Lifting, welding, and packaging of a quality-factor-controllable micromachined inductor using magnetic fields

Huang

Jang

Fang

2010

J. Micro/Nanolith. MEMS MOEMS

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This study demonstrates a novel approach to lift the inductor from the lossy substrate by static magnetic field. The lift angle of the inductor, which tuned by a position stage, is employed to control the quality factor of the inductor. The lifted inductor is then welded by localized induction heating using the ac magnetic field. Thus, the heating-induced thermal problem is prevented. In addition, the inductor is also simultaneously packaged inside a Si capping by the alternating magnetic field. To demonstrate the feasibility of the proposed concept, the meander strip inductor was fabricated and tested. The radio frequency performance of the inductor at various tilting angles away from the substrate (0, 45, and 90 deg) was characterized by using a two-port vector network analyzer. The quality factor has been improved from 4.2 (at the central frequency of 0.64 GHz) to 7.9 (at the central frequency of 0.74 GHz), as the lift angle increased from 0 to 90 deg. In other words, the central frequency of the inductor can also be varied from 0.64 to 0.74 GHz. Measurement results also indicate that the bonded Si capping has a good shear strength of 23.5 MPa. C 2010 Society of Photo-Optical Instrumentation Engineers.

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“…Due to the change of the internal residual stress by thermal annealing, the height of the inductor can be changed, resulting in the change of inductance. Using the metal-plate-shielding, Sugawara et al [9] proposed the variable inductor embedded in Si CMOS chip. By moving a metal plate above the inductor, the inductance value can be varied.…”

Section: Introductionmentioning

confidence: 99%

Implementation and characterization of a tunable quality factor micromachined inductor

Huang

Jang

Fang

2009

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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This study demonstrated a novel tunable quality factor and self-assembly inductor using an alternating magnetic flux. The merit of the design was to tilt the inductor from the lossy substrate and localize welding for assembly simultaneously using the magnetic film. The 8-turn of meander strip inductor with a thickness of 10 μm was fabricated using MicroElectroMechanical Systems (MEMS) technology. The RF performance of the inductor at various tilting angles away from the substrate (0 o , 45 o , and 90 o ) was characterized by using a two-port vector network analyzer (VNA). The measurement results indicated that the quality factor (Q) and the self-resonant frequency (f res ) can be enhanced about 107% and 1.08%, respectively.

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Variable RF Inductor on Si CMOS Chip

Cited by 25 publications

References 3 publications

A dynamic reconfigurable RF circuit architecture

A dynamic reconfigurable RF circuit architecture

Lifting, welding, and packaging of a quality-factor-controllable micromachined inductor using magnetic fields

Implementation and characterization of a tunable quality factor micromachined inductor

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